×

WLCSP6_3-2

WLCSP6_3-2

wafer level chip-size package; 6 bumps (3 x 2)

Package information

Package information Package name Package description Reference Date
WLCSP6_3-2 WLCSP6 wafer level chip-size package; 6 bumps (3 x 2) 2017-04-13

Related documents

File name Title Type Date
WLCSP6_3-2 3D model for products with WLCSP6_3-2 package Design support 2023-03-13
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
nexperia_document_leaflet_WLCSP_201803 Small-signal MOSFETs in WLCSP - Smallest size - lowest RDS(on) Leaflet 2018-04-25
nexperia_document_leaflet_WLCSP_201803_CHN WLCSP Chinese Translation Leaflet 2018-04-25
WLCSP6_3-2 wafer level chip-size package; 6 bumps (3 x 2) Package information 2022-07-13

Products in this package

MOSFETs

Type number Description Quick access
PMCM6501UPE 20 V, P-channel Trench MOSFET