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Click here for more informationBAS21LS
High-speed switching diode
High-speed switching diode, encapsulated in a leadless ultra small DFN1006BD-2 (SOD882BD) Surface-Mounted Device (SMD) plastic package with side-wettable flanks.
Alternatives
Features and benefits
- High switching speed: trr ≤ 50 ns
- Low leakage current
- High reverse voltage VR ≤ 200 V
- Low capacitance: Cd ≤ 2 pF
- Ultra small and leadless SMD plastic package
- Suitable for Automatic Optical Inspection (AOI) of solder joint
Applications
- High-speed switching
- General-purpose switching
- Voltage clamping
- Reverse polarity protection
Parametrics
| Type number | Package version | Package name | Size (mm) | Automotive qualified |
|---|---|---|---|---|
| BAS21LS | SOD882BD | DFN1006BD-2 | 1 x 0.6 x 0.47 | N |
Package
All type numbers in the table below are discontinued.
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| BAS21LS | BAS21LSYL (934661544315) |
Withdrawn / End-of-life | M9 |
DFN1006BD‑2 (SOD882BD) |
SOD882BD | SOD882BD_315 |
Environmental information
All type numbers in the table below are discontinued.
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| BAS21LS | BAS21LSYL | BAS21LS |
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Series
Documentation (11)
| File name | Title | Type | Date |
|---|---|---|---|
| BAS21LS | High-speed switching diode | Data sheet | 2021-10-07 |
| AN90023 | Thermal performance of DFN packages | Application note | 2020-11-23 |
| AN90023_ZH | Thermal performance of DFN packages | Application note | 2021-02-26 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| Nexperia_asset_document_brochure_autoDFN_CN_LR | 小巧轻便的汽车 二极管和晶体管 | Brochure | 2022-04-26 |
| SOD882BD | 3D model for products with SOD882BD package | Design support | 2023-02-02 |
| Nexperia_AutoDFN_factsheet_2022 | Small & light automotive diodes and transistors | Leaflet | 2022-04-13 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Other type | 2026-02-10 |
| SOD882BD | Leadless ultra small plastic package with side-wettable flanks (SWF); 2 terminals; 0.65 mm pitch; 1 mm x 0.6 mm x 0.47 mm body | Package information | 2022-05-20 |
| BAS21LS_Nexperia_Product_Reliability | BAS21LS Nexperia Product Reliability | Quality document | 2022-03-21 |
| BAS21LS | BAS21LS SPICE model | SPICE model | 2026-02-24 |
Support
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Please visit our engineer exchange forum or contact us for further support.
Longevity
The Nexperia Longevity Program is aimed to provide our customers information from time to time about the expected time that our products can be ordered. The NLP is reviewed and updated regularly by our Executive Management Team. View our longevity program here.
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.