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Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

74LVC573A-Q100

Octal D-type transparent latch with 5 V tolerantinputs/outputs; 3-state

The 74LVC573A-Q100 is an 8-bit D-type transparent latch with 3-state outputs. The device features latch enable (LE) and output enable (OE) inputs. When LE is HIGH, data at the inputs enter the latches. In this condition the latches are transparent, a latch output will change each time its corresponding D-input changes. When LE is LOW the latches store the information that was present at the inputs a set-up time preceding the HIGH-to-LOW transition of LE. A HIGH on OE causes the outputs to assume a high-impedance OFF-state. Operation of the OE input does not affect the state of the latches. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V environments.

Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times.

This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.

Features and benefits

  • Automotive product qualification in accordance with AEC-Q100 (Grade 1)

    • Specified from -40 °C to +85 °C and from -40 °C to +125 °C

  • Wide supply voltage range from 1.2 to 3.6 V

  • Overvoltage tolerant inputs to 5.5 V

  • CMOS low power consumption

  • Direct interface with TTL levels

  • IOFF circuitry provides partial Power-down mode operation

  • High-impedance when VCC = 0 V

  • Flow-through pinout architecture

  • Complies with JEDEC standard:

    • JESD8-7A (1.65 V to 1.95 V)

    • JESD8-5A (2.3 V to 2.7 V)

    • JESD8-C/JESD36 (2.7 V to 3.6 V)

  • ESD protection:

    • MIL-STD-883, method 3015 exceeds 2000 V

    • HBM JESD22-A114F exceeds 2000 V

    • MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0 Ω)

  • DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints

Parametrics

Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)tpd (ns)fmax (MHz)Power dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
74LVC573ABQ-Q100Production1.2 - 3.6TTL± 243.48low-40~125799.550DHVQFN20
74LVC573AD-Q100Production1.2 - 3.6TTL± 243.48low-40~1258527.661SO20
74LVC573APW-Q100Production1.2 - 3.6TTL± 243.48low-40~1251014.745TSSOP20

Package

Type numberPackagePackage informationReflow-/Wave solderingPackingStatusMarkingOrderable part number, (Ordering code (12NC))
74LVC573ABQ-Q100
DHVQFN20
(SOT764-1)
SOT764-1SOT764-1_115ActiveLVC573A74LVC573ABQ-Q100X
( 9353 002 36115 )
74LVC573AD-Q100
SO20
(SOT163-1)
SOT163-1WAVE_BG-BD-1
SOT163-1_118Active74LVC573AD74LVC573AD-Q100J
( 9353 002 37118 )
74LVC573APW-Q100
TSSOP20
(SOT360-1)
SOT360-1SSOP-TSSOP-VSO-WAVE
SOT360-1_118ActiveLVC573A74LVC573APW-Q100J
( 9353 002 38118 )

Environmental information

Type numberOrderable part numberChemical contentRoHSRHF-indicatorLeadfree conversion date
74LVC573ABQ-Q10074LVC573ABQ-Q100X74LVC573ABQ-Q100Always Pb-free
74LVC573AD-Q10074LVC573AD-Q100J74LVC573AD-Q100Always Pb-free
74LVC573APW-Q10074LVC573APW-Q100J74LVC573APW-Q100Always Pb-free
Quality and reliability disclaimer

Documentation (11)

File nameTitleTypeDate
74LVC573A_Q100Octal D-type transparent latch with 5 V tolerant inputs/outputs; 3-stateData sheet2020-03-30
AN263Power considerations when using CMOS and BiCMOS logic devicesApplication note2023-02-07
AN11009Pin FMEA for LVC familyApplication note2019-01-09
lvc573alvc573a IBIS modelIBIS model2013-04-07
Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
lvclvc Spice modelSPICE model2013-05-06
SOT764-1plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm bodyPackage information2022-06-21
SSOP-TSSOP-VSO-WAVEFootprint for wave solderingWave soldering2009-10-08
SOT360-1plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm bodyPackage information2022-06-21
SOT163-1plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm bodyPackage information2022-06-20
WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08

Support

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Models

File nameTitleTypeDate
lvc573alvc573a IBIS modelIBIS model2013-04-07
lvclvc Spice modelSPICE model2013-05-06

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