Features and benefits
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Enhancement mode - normally-off power switch
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Ultra high frequency switching capability
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No body diode
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Low gate charge, low output charge
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Qualified for standard applications
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ESD protection
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RoHS, Pb-free, REACH-compliant
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High efficiency and high power density
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Wafer Level Chip-Scale Package (WLCSP) 3.5 mm x 2.13 mm
Applications
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High power density and high efficiency power conversion
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AC-to-DC converters, (secondary stage)
- High frequency DC-to-DC converters in 48 V systems
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Fast battery charging, mobile phone, laptop, tablet and USB type-C chargers
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Datacom and telecom (AC-to-DC and DC-to-DC) converters
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Motor drives
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LiDAR (non-automotive)
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Class D audio amplifiers
Parametrics
Type number | Package version | Package name | Product status | Configuration | Channel type | Nr of transistors | VDS [max] (V) | RDSon [max] @ VGS = 5 V (mΩ) | Tj [max] (°C) | QGD [typ] (nC) | Ptot [max] (W) | VGSth [typ] (V) | Automotive qualified | Ciss [typ] (pF) | Coss [typ] (pF) | Date |
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GAN3R2-100CBE | WLCSP8-SOT8072 | WLCSP8 | Production | e-mode | N | 1 | 100 | 3.2 | 150 | 1.7 | 394 | 1.1 | N | 1000 | 460 | 2023-02-22 |
PCB Symbol, Footprint and 3D Model
Model Name | Description |
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Package
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
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GAN3R2-100CBE | GAN3R2-100CBEAZ ( 9346 658 99341 ) | Active | 3R2DCBE | ![]() WLCSP8 (WLCSP8-SOT8072) | WLCSP8-SOT8072 | WLCSP8-SOT8072_341 |
Environmental information
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
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GAN3R2-100CBE | GAN3R2-100CBEAZ | Not available |
Documentation (18)
File name | Title | Type | Date |
---|---|---|---|
GAN3R2-100CBE | 100 V, 3.2 mOhm Gallium Nitride (GaN) FET in a 3.5 mm x 2.13 mm Wafer Level Chip-Scale Package (WLCSP) | Data sheet | 2023-04-27 |
AN90005 | Understanding Power GaN FET data sheet parameters | Application note | 2020-06-08 |
AN90004 | Probing considerations for fast switching applications | Application note | 2019-11-15 |
AN90006 | Circuit design and PCB layout recommendations for GaN FET half bridges | Application note | 2019-11-15 |
AN90021 | Power GaN technology: the need for efficient power conversion | Application note | 2020-08-14 |
AN90041 | Gate drive circuit design for Nexperia 650 V Enhancement mode (e-mode) GaN FETs | Application note | 2023-05-09 |
WLCSP8-SOT8072 | 3D model for products with WLCSP8-SOT8072 package | Design support | 2023-04-13 |
GAN3R2-100CBE | GAN3R2-100CBE SPICE model | SPICE model | 2023-04-12 |
TN90004 | An insight into Nexperia Power GaN technology – Applications, quality, reliability and scalability | Technical note | 2020-07-21 |
CauerModel_GAN3R2-100CBE | Cauer model GAN3R2-100CBE | Thermal model | 2023-04-12 |
FosterModel_GAN3R2-100CBE | Foster model GAN3R2-100CBE | Thermal model | 2023-04-12 |
GAN3R2-100CBE | GAN3R2-100CBE RC thermal model | Thermal model | 2023-04-12 |
GAN3R2-100CBE_Cauer | GAN3R2-100CBE Cauer model | Thermal model | 2023-04-12 |
GAN3R2-100CBE_Foster | GAN3R2-100CB Foster model | Thermal model | 2023-04-12 |
nexperia_whitepaper_gan_need_for_efficient_conversion | White paper: Power GaN technology: the need for efficient power conversion | White paper | 2020-07-23 |
nexperia_whitepaper_gan_need_for_efficient_conversion_CHN | 白皮书: 功率GaN技术: 高效功率转换的需求 | White paper | 2020-08-17 |
nexperia_whitepaper_gan_need_for_efficient_conversion_Japanese | Whitepaper: GaN need for efficient conversion (Japanese) | White paper | 2021-05-20 |
WLCSP8-SOT8072_341 | WLCSP8; Reel dry pack for SMD, 7"; Q2/T3 product orientation | Packing information | 2023-04-18 |
Support
If you are in need of design/technical support, let us know and fill in the answer form, we'll get back to you shortly.
Models
File name | Title | Type | Date |
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WLCSP8-SOT8072 | 3D model for products with WLCSP8-SOT8072 package | Design support | 2023-04-13 |
GAN3R2-100CBE | GAN3R2-100CBE SPICE model | SPICE model | 2023-04-12 |
CauerModel_GAN3R2-100CBE | Cauer model GAN3R2-100CBE | Thermal model | 2023-04-12 |
FosterModel_GAN3R2-100CBE | Foster model GAN3R2-100CBE | Thermal model | 2023-04-12 |
GAN3R2-100CBE | GAN3R2-100CBE RC thermal model | Thermal model | 2023-04-12 |
GAN3R2-100CBE_Cauer | GAN3R2-100CBE Cauer model | Thermal model | 2023-04-12 |
GAN3R2-100CBE_Foster | GAN3R2-100CB Foster model | Thermal model | 2023-04-12 |
PCB Symbol, Footprint and 3D Model
Model Name | Description |
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Ordering, pricing & availability
Type number | Orderable part number | Ordering code (12NC) | Packing | Packing quantity | Buy online |
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GAN3R2-100CBE | GAN3R2-100CBEAZ | 934665899341 | WLCSP8-SOT8072_341 | - | Order product |
Sample
As a Nexperia customer you can order samples via our sales organization or directly via our Online Sample Store: https://extranet.nexperia.com.
Sample orders normally take 2-4 days for delivery.
If you do not have a direct account with Nexperia our network of global and regional distributors is available and equipped to support you with Nexperia samples.
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.