- Block diagram
- Design considerations
- Product listing
- Support
Block diagram
Battery Management System
Power interface
Power management
Recommended products (8)
- DC-DC converters: 1.8-5.0 V
- LDO regulators: 40 V, 150 mA
- Power distribution: Load switch, 5.5 V, 55 mΩ
- Zener diodes: 500 mW, SOD123F
- Low VCEsat transistors: ±40 V, ±0.5 A, DFN
- Schottky diodes and rectifiers: 40-100 V, CFP
- Voltage regulator diodes: DFN1006
- MOSFETs: 40-100 V, RDSon 5-15 mΩ, LFPAK / MLPAK
Sensor interface
Signal processing
Gate driver
Recommended products (3)
Motor drive
Select a component
To view more information about the Nexperia components used in this application, please select a component above or click on a component (highlighted in blue) in the block diagram.
Design considerations
- Trend is towards more powerful PWM driven Brushless DC motor control
- Best thermal performance thanks to clip-bonding package, Rth 3x better than competition resulting in half the temperature
- Lower switch losses further improve thermal behaviour
- Reliable clip-bonding package technology for high anti stall robustness
- LFPAK and CFP (both clip-bond package) allow high-efficiency motor drive and DCDC converter solutions while reducing costs (less heating to dissipate, smaller inductance and capacitor)
- For specific applications MOSFETs may need to meet different spacing requirements like UL2595
Product listing
Battery Management System
Power interface
Power management
- DC-DC converters: 1.8-5.0 V
- LDO regulators: 40 V, 150 mA
- Power distribution: Load switch, 5.5 V, 55 mΩ
- Zener diodes: 500 mW, SOD123F
- Low VCEsat transistors: ±40 V, ±0.5 A, DFN
- Schottky diodes and rectifiers: 40-100 V, CFP
- Voltage regulator diodes: DFN1006
- MOSFETs: 40-100 V, RDSon 5-15 mΩ, LFPAK / MLPAK