Chemical content 2N7002BKS

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Type numberPackagePackage descriptionTotal product weight
2N7002BKSSOT363SC-885.46853 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934064284125112601235Kyoto, Japan; Seremban, Malaysia 
934064284115712601235Seremban, Malaysia; Kyoto, Japan 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieAluminium alloyAluminium (Al)7429-90-50.002542.540000.04645
Doped siliconSilicon (Si)7440-21-30.0910391.030001.66462
Gold alloyGold (Au)7440-57-50.006436.430000.11758
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.001860.090000.03407
Carbon (C)7440-44-00.000830.040000.01514
Chromium (Cr)7440-47-30.004350.210000.07949
Cobalt (Co)7440-48-40.008900.430000.16277
Iron (Fe)7439-89-60.9811847.4000017.94230
Manganese (Mn)7439-96-50.017600.850000.32175
Nickel (Ni)7440-02-00.7392035.7100013.51729
Phosphorus (P)7723-14-00.000410.020000.00757
Silicon (Si)7440-21-30.005380.260000.09842
Sulphur (S)7704-34-90.000410.020000.00757
Pure metal layerCopper (Cu)7440-50-80.2713813.110004.96252
Silver (Ag)7440-22-40.038501.860000.70406
Mould CompoundAdditiveNon hazardousProprietary0.084682.900001.54850
FillerSilica -amorphous-7631-86-92.1024072.0000038.44543
PigmentCarbon black1333-86-40.001460.050000.02670
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.4380015.000008.00947
Phenol Formaldehyde resin (generic)9003-35-40.2920010.000005.33964
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00020
Bismuth (Bi)7440-69-90.000000.001000.00007
Copper (Cu)7440-50-80.000000.001000.00007
Lead (Pb)7439-92-10.000020.005000.00034
Tin solderTin (Sn)7440-31-50.3699699.990006.76531
WirePure metalCopper (Cu)7440-50-80.00853100.000000.15599
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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