Chemical content 74AUP1G32GN

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Type numberPackagePackage descriptionTotal product weight
74AUP1G32GNSOT1115X2SON60.85923 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935291735132512601235Shanghai, China; Nijmegen, Netherlands; Bangkok, Thailand; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.02051100.000002.38748
ComponentAdditiveNon hazardousProprietary0.000255.000000.02910
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.02910
Silica -amorphous-7631-86-90.0025050.000000.29096
PolymerEpoxy resin systemProprietary0.0015030.000000.17457
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.05819
Lead FrameCopper alloyCopper (Cu)7440-50-80.3638694.5100042.34763
Magnesium (Mg)7439-95-40.000580.150000.06721
Nickel (Ni)7440-02-00.011362.950001.32182
Silicon (Si)7440-21-30.002460.640000.28677
Pure metal layerGold (Au)7440-57-50.000080.020000.00896
Nickel (Ni)7440-02-00.006311.640000.73484
Palladium (Pd)7440-05-30.000350.090000.04033
Mould CompoundAdditiveNon hazardousProprietary0.001780.410000.20757
FillerSilica -amorphous-7631-86-90.001260.290000.14682
Silica fused60676-86-00.3747586.1500043.61492
HardenerPhenolic resinProprietary0.018664.290002.17189
PigmentCarbon black1333-86-40.000830.190000.09619
PolymerEpoxy resin systemProprietary0.037718.670004.38934
WireGold alloyGold (Au)7440-57-50.0135899.000001.58081
Palladium (Pd)7440-05-30.000141.000000.01597
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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