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Chemical content 74AUP1G86GN

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Type numberPackagePackage descriptionTotal product weight
74AUP1G86GNSOT1115X2SON60.87054 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935291747132512601235Seremban, Malaysia; Bangkok, Thailand; Shanghai, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.03146100.000003.61327
subTotal0.03146100.000003.61327
ComponentAdditiveNon hazardousProprietary0.000255.000000.02872
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.02872
Silica -amorphous-7631-86-90.0025050.000000.28718
PolymerEpoxy resin systemProprietary0.0015030.000000.17231
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.05744
subTotal0.00500100.000000.57437
Lead FrameCopper alloyCopper (Cu)7440-50-80.3638694.5100041.79745
Magnesium (Mg)7439-95-40.000580.150000.06634
Nickel (Ni)7440-02-00.011362.950001.30465
Silicon (Si)7440-21-30.002460.640000.28304
Pure metal layerGold (Au)7440-57-50.000080.020000.00885
Nickel (Ni)7440-02-00.006311.640000.72530
Palladium (Pd)7440-05-30.000350.090000.03980
subTotal0.38500100.0000044.22543
Mould CompoundAdditiveNon hazardousProprietary0.001780.410000.20487
FillerSilica -amorphous-7631-86-90.001260.290000.14491
Silica fused60676-86-00.3747586.1500043.04828
HardenerPhenolic resinProprietary0.018664.290002.14367
PigmentCarbon black1333-86-40.000830.190000.09494
PolymerEpoxy resin systemProprietary0.037718.670004.33231
subTotal0.43500100.0000049.96898
WireGold alloyGold (Au)7440-57-50.0139599.000001.60235
Palladium (Pd)7440-05-30.000141.000000.01619
subTotal0.01409100.000001.61854
total0.87054100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.