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Chemical content 74AUP1G97GN

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Type numberPackagePackage descriptionTotal product weight
74AUP1G97GNSOT1115X2SON60.88730 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935291748132312601235Nijmegen, Netherlands; Seremban, Malaysia; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.04510100.000005.08317
subTotal0.04510100.000005.08317
ComponentAdditiveNon hazardousProprietary0.000255.000000.02818
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.02818
Silica -amorphous-7631-86-90.0025050.000000.28175
PolymerEpoxy resin systemProprietary0.0015030.000000.16905
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.05635
subTotal0.00500100.000000.56351
Lead FrameCopper alloyCopper (Cu)7440-50-80.3638694.5100041.00795
Magnesium (Mg)7439-95-40.000580.150000.06509
Nickel (Ni)7440-02-00.011362.950001.28001
Silicon (Si)7440-21-30.002460.640000.27770
Pure metal layerGold (Au)7440-57-50.000080.020000.00868
Nickel (Ni)7440-02-00.006311.640000.71160
Palladium (Pd)7440-05-30.000350.090000.03905
subTotal0.38500100.0000043.39008
Mould CompoundAdditiveNon hazardousProprietary0.001780.410000.20100
FillerSilica -amorphous-7631-86-90.001260.290000.14217
Silica fused60676-86-00.3747586.1500042.23515
HardenerPhenolic resinProprietary0.018664.290002.10318
PigmentCarbon black1333-86-40.000830.190000.09315
PolymerEpoxy resin systemProprietary0.037718.670004.25048
subTotal0.43500100.0000049.02513
WireGold alloyGold (Au)7440-57-50.0170299.000001.91852
Palladium (Pd)7440-05-30.000171.000000.01938
subTotal0.01720100.000001.93790
total0.88730100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.