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Chemical content 74AUP1T34GN

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Type numberPackagePackage descriptionTotal product weight
74AUP1T34GNSOT1115X2SON60.86167 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935291752132612601235Nijmegen, Netherlands; Bangkok, Thailand; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.02351100.000002.72873
subTotal0.02351100.000002.72873
ComponentAdditiveNon hazardousProprietary0.000255.000000.02901
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.02901
Silica -amorphous-7631-86-90.0025050.000000.29013
PolymerEpoxy resin systemProprietary0.0015030.000000.17408
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.05803
subTotal0.00500100.000000.58026
Lead FrameCopper alloyCopper (Cu)7440-50-80.3638694.5100042.22771
Magnesium (Mg)7439-95-40.000580.150000.06702
Nickel (Ni)7440-02-00.011362.950001.31808
Silicon (Si)7440-21-30.002460.640000.28596
Pure metal layerGold (Au)7440-57-50.000080.020000.00894
Nickel (Ni)7440-02-00.006311.640000.73276
Palladium (Pd)7440-05-30.000350.090000.04021
subTotal0.38500100.0000044.68068
Mould CompoundAdditiveNon hazardousProprietary0.001780.410000.20698
FillerSilica -amorphous-7631-86-90.001260.290000.14640
Silica fused60676-86-00.3747586.1500043.49142
HardenerPhenolic resinProprietary0.018664.290002.16574
PigmentCarbon black1333-86-40.000830.190000.09592
PolymerEpoxy resin systemProprietary0.037718.670004.37691
subTotal0.43500100.0000050.48337
WireGold alloyGold (Au)7440-57-50.0130299.000001.51142
Palladium (Pd)7440-05-30.000131.000000.01527
subTotal0.01316100.000001.52669
total0.86167100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.