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Chemical content 74AUP1T45GN

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Type numberPackagePackage descriptionTotal product weight
74AUP1T45GNSOT1115X2SON60.88430 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935291753132512601235Seremban, Malaysia; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.04207100.000004.75756
subTotal0.04207100.000004.75756
ComponentAdditiveNon hazardousProprietary0.000255.000000.02827
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.02827
Silica -amorphous-7631-86-90.0025050.000000.28271
PolymerEpoxy resin systemProprietary0.0015030.000000.16963
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.05654
subTotal0.00500100.000000.56542
Lead FrameCopper alloyCopper (Cu)7440-50-80.3638694.5100041.14707
Magnesium (Mg)7439-95-40.000580.150000.06531
Nickel (Ni)7440-02-00.011362.950001.28435
Silicon (Si)7440-21-30.002460.640000.27864
Pure metal layerGold (Au)7440-57-50.000080.020000.00871
Nickel (Ni)7440-02-00.006311.640000.71401
Palladium (Pd)7440-05-30.000350.090000.03918
subTotal0.38500100.0000043.53727
Mould CompoundAdditiveNon hazardousProprietary0.001780.410000.20168
FillerSilica -amorphous-7631-86-90.001260.290000.14266
Silica fused60676-86-00.3747586.1500042.37843
HardenerPhenolic resinProprietary0.018664.290002.11031
PigmentCarbon black1333-86-40.000830.190000.09346
PolymerEpoxy resin systemProprietary0.037718.670004.26490
subTotal0.43500100.0000049.19144
WireGold alloyGold (Au)7440-57-50.0170599.000001.92839
Palladium (Pd)7440-05-30.000171.000000.01948
subTotal0.01722100.000001.94787
total0.88430100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.