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Chemical content 74CBTLV1G125GN

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Type numberPackagePackage descriptionTotal product weight
74CBTLV1G125GNSOT1115X2SON60.87615 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935291767132612601235Nijmegen, Netherlands; Bangkok, Thailand; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.03645100.000004.16007
subTotal0.03645100.000004.16007
ComponentAdditiveNon hazardousProprietary0.000255.000000.02853
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.02853
Silica -amorphous-7631-86-90.0025050.000000.28534
PolymerEpoxy resin systemProprietary0.0015030.000000.17120
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.05707
subTotal0.00500100.000000.57067
Lead FrameCopper alloyCopper (Cu)7440-50-80.3638694.5100041.52982
Magnesium (Mg)7439-95-40.000580.150000.06591
Nickel (Ni)7440-02-00.011362.950001.29630
Silicon (Si)7440-21-30.002460.640000.28123
Pure metal layerGold (Au)7440-57-50.000080.020000.00879
Nickel (Ni)7440-02-00.006311.640000.72065
Palladium (Pd)7440-05-30.000350.090000.03955
subTotal0.38500100.0000043.94225
Mould CompoundAdditiveNon hazardousProprietary0.001780.410000.20356
FillerSilica -amorphous-7631-86-90.001260.290000.14398
Silica fused60676-86-00.3747586.1500042.77264
HardenerPhenolic resinProprietary0.018664.290002.12994
PigmentCarbon black1333-86-40.000830.190000.09433
PolymerEpoxy resin systemProprietary0.037718.670004.30457
subTotal0.43500100.0000049.64902
WireGold alloyGold (Au)7440-57-50.0145599.000001.66102
Palladium (Pd)7440-05-30.000151.000000.01678
subTotal0.01470100.000001.67780
total0.87615100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.