×

Chemical content 74HC132BQ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74HC132BQSOT762-1DHVQFN1421.81314 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935690724115712601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0945280.100000.43331
PolymerResin systemProprietary0.0234819.900000.10765
subTotal0.11800100.000000.54096
DieDoped siliconSilicon (Si)7440-21-30.19791100.000000.90730
subTotal0.19791100.000000.90730
Lead FrameCopper alloyCopper (Cu)7440-50-88.4266896.1950038.63122
Iron (Fe)7439-89-60.205522.346100.94218
Phosphorus (P)7723-14-00.002650.030200.01213
Zinc (Zn)7440-66-60.008890.101500.04076
Pure metal layerGold (Au)7440-57-50.002650.030200.01213
Nickel (Ni)7440-02-00.106921.220500.49014
Palladium (Pd)7440-05-30.004910.056000.02249
Silver (Ag)7440-22-40.001800.020500.00823
subTotal8.76000100.0000040.15928
Mould CompoundAdditiveNon hazardousProprietary0.369162.910001.69239
FillerSilica -amorphous-7631-86-90.442743.490002.02970
Silica fused60676-86-010.7602784.8200049.32928
PigmentCarbon black1333-86-40.020300.160000.09305
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.137011.080000.62810
Epoxy resin systemProprietary0.201711.590000.92471
Phenolic resinProprietary0.285442.250001.30855
Tetramethylbiphenyl diglycidyl ether85954-11-60.469383.700002.15183
subTotal12.68600100.0000058.15761
WirePure metalCopper (Cu)7440-50-80.0494696.550000.22675
Pure metal layerGold (Au)7440-57-50.000180.350000.00082
Palladium (Pd)7440-05-30.001593.100000.00728
subTotal0.05123100.000000.23485
total21.81314100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.