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Chemical content 74HC4066BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC4066BQ-Q100SOT762-1DHVQFN1418.32864 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935298454115812601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0186380.100000.10165
PolymerResin systemProprietary0.0046319.900000.02525
subTotal0.02326100.000000.12690
DieDoped siliconSilicon (Si)7440-21-30.35253100.000001.92338
subTotal0.35253100.000001.92338
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.7447197.4700036.79875
Iron (Fe)7439-89-60.166072.400000.90609
Phosphorus (P)7723-14-00.002080.030000.01133
Zinc (Zn)7440-66-60.006920.100000.03775
subTotal6.91978100.0000037.75392
Mould CompoundAdditiveNon hazardousProprietary0.306132.910001.67024
FillerSilica -amorphous-7631-86-90.367153.490002.00314
Silica fused60676-86-08.9230784.8200048.68377
PigmentCarbon black1333-86-40.016830.160000.09183
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.113621.080000.61988
Epoxy resin systemProprietary0.167271.590000.91261
Phenolic resinProprietary0.236702.250001.29142
Tetramethylbiphenyl diglycidyl ether85954-11-60.389243.700002.12367
subTotal10.52001100.0000057.39656
Pre-PlatingPure metal layerGold (Au)7440-57-50.013843.000000.07552
Nickel (Ni)7440-02-00.4258792.300002.32353
Palladium (Pd)7440-05-30.014303.100000.07804
Silver (Ag)7440-22-40.007381.600000.04028
subTotal0.46140100.000002.51737
WirePure metalCopper (Cu)7440-50-80.0498896.550000.27215
Pure metal layerGold (Au)7440-57-50.000180.350000.00099
Palladium (Pd)7440-05-30.001603.100000.00874
subTotal0.05166100.000000.28188
total18.32864100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.