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Chemical content 74LVC1G10GN

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Type numberPackagePackage descriptionTotal product weight
74LVC1G10GNSOT1115X2SON60.86851 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935291775132612601235Seremban, Malaysia; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.02723100.000003.13480
subTotal0.02723100.000003.13480
ComponentAdditiveNon hazardousProprietary0.000255.000000.02878
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.02878
Silica -amorphous-7631-86-90.0025050.000000.28785
PolymerEpoxy resin systemProprietary0.0015030.000000.17271
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.05757
subTotal0.00500100.000000.57569
Lead FrameCopper alloyCopper (Cu)7440-50-80.3638694.5100041.89514
Magnesium (Mg)7439-95-40.000580.150000.06649
Nickel (Ni)7440-02-00.011362.950001.30770
Silicon (Si)7440-21-30.002460.640000.28370
Pure metal layerGold (Au)7440-57-50.000080.020000.00887
Nickel (Ni)7440-02-00.006311.640000.72699
Palladium (Pd)7440-05-30.000350.090000.03990
subTotal0.38500100.0000044.32879
Mould CompoundAdditiveNon hazardousProprietary0.001780.410000.20535
FillerSilica -amorphous-7631-86-90.001260.290000.14525
Silica fused60676-86-00.3747586.1500043.14890
HardenerPhenolic resinProprietary0.018664.290002.14868
PigmentCarbon black1333-86-40.000830.190000.09516
PolymerEpoxy resin systemProprietary0.037718.670004.34244
subTotal0.43500100.0000050.08578
WireGold alloyGold (Au)7440-57-50.0161299.000001.85573
Palladium (Pd)7440-05-30.000161.000000.01874
subTotal0.01628100.000001.87447
total0.86851100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.