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Chemical content 74LVC1G157GN

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Type numberPackagePackage descriptionTotal product weight
74LVC1G157GNSOT1115X2SON60.87508 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935291778132612601235Bangkok, Thailand; Nijmegen, Netherlands; Hefei, China; Seremban, Malaysia; Shanghai, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.03425100.000003.91404
subTotal0.03425100.000003.91404
ComponentAdditiveNon hazardousProprietary0.000255.000000.02857
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.02857
Silica -amorphous-7631-86-90.0025050.000000.28569
PolymerEpoxy resin systemProprietary0.0015030.000000.17141
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.05714
subTotal0.00500100.000000.57138
Lead FrameCopper alloyCopper (Cu)7440-50-80.3638694.5100041.58060
Magnesium (Mg)7439-95-40.000580.150000.06599
Nickel (Ni)7440-02-00.011362.950001.29788
Silicon (Si)7440-21-30.002460.640000.28157
Pure metal layerGold (Au)7440-57-50.000080.020000.00880
Nickel (Ni)7440-02-00.006311.640000.72153
Palladium (Pd)7440-05-30.000350.090000.03960
subTotal0.38500100.0000043.99597
Mould CompoundAdditiveNon hazardousProprietary0.001780.410000.20381
FillerSilica -amorphous-7631-86-90.001260.290000.14416
Silica fused60676-86-00.3747586.1500042.82494
HardenerPhenolic resinProprietary0.018664.290002.13255
PigmentCarbon black1333-86-40.000830.190000.09445
PolymerEpoxy resin systemProprietary0.037718.670004.30983
subTotal0.43500100.0000049.70974
WireGold alloyGold (Au)7440-57-50.0156799.000001.79089
Palladium (Pd)7440-05-30.000161.000000.01809
subTotal0.01583100.000001.80898
total0.87508100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.