×

Chemical content 74LVC1G3157GN

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74LVC1G3157GNSOT1115X2SON60.88975 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935291783132712601235Shanghai, China; Hefei, China; Nijmegen, Netherlands; Hsin-chu, Taiwan; Bangkok, Thailand; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.04806100.000005.40110
subTotal0.04806100.000005.40110
ComponentAdditiveNon hazardousProprietary0.000255.000000.02810
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.02810
Silica -amorphous-7631-86-90.0025050.000000.28098
PolymerEpoxy resin systemProprietary0.0015030.000000.16859
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.05620
subTotal0.00500100.000000.56197
Lead FrameCopper alloyCopper (Cu)7440-50-80.3638694.5100040.89503
Magnesium (Mg)7439-95-40.000580.150000.06491
Nickel (Ni)7440-02-00.011362.950001.27648
Silicon (Si)7440-21-30.002460.640000.27693
Pure metal layerGold (Au)7440-57-50.000080.020000.00865
Nickel (Ni)7440-02-00.006311.640000.70964
Palladium (Pd)7440-05-30.000350.090000.03894
subTotal0.38500100.0000043.27058
Mould CompoundAdditiveNon hazardousProprietary0.001780.410000.20045
FillerSilica -amorphous-7631-86-90.001260.290000.14178
Silica fused60676-86-00.3747586.1500042.11885
HardenerPhenolic resinProprietary0.018664.290002.09739
PigmentCarbon black1333-86-40.000830.190000.09289
PolymerEpoxy resin systemProprietary0.037718.670004.23877
subTotal0.43500100.0000048.89013
WireGold alloyGold (Au)7440-57-50.0165399.000001.85761
Palladium (Pd)7440-05-30.000171.000000.01876
subTotal0.01670100.000001.87637
total0.88975100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.