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Chemical content 74LVC1G80GN

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Type numberPackagePackage descriptionTotal product weight
74LVC1G80GNSOT1115X2SON60.86907 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935291793132612601235Bangkok, Thailand; Nijmegen, Netherlands; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.03045100.000003.50326
subTotal0.03045100.000003.50326
ComponentAdditiveNon hazardousProprietary0.000255.000000.02877
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.02877
Silica -amorphous-7631-86-90.0025050.000000.28766
PolymerEpoxy resin systemProprietary0.0015030.000000.17260
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.05753
subTotal0.00500100.000000.57533
Lead FrameCopper alloyCopper (Cu)7440-50-80.3638694.5100041.86815
Magnesium (Mg)7439-95-40.000580.150000.06645
Nickel (Ni)7440-02-00.011362.950001.30686
Silicon (Si)7440-21-30.002460.640000.28352
Pure metal layerGold (Au)7440-57-50.000080.020000.00886
Nickel (Ni)7440-02-00.006311.640000.72652
Palladium (Pd)7440-05-30.000350.090000.03987
subTotal0.38500100.0000044.30023
Mould CompoundAdditiveNon hazardousProprietary0.001780.410000.20522
FillerSilica -amorphous-7631-86-90.001260.290000.14516
Silica fused60676-86-00.3747586.1500043.12109
HardenerPhenolic resinProprietary0.018664.290002.14730
PigmentCarbon black1333-86-40.000830.190000.09510
PolymerEpoxy resin systemProprietary0.037718.670004.33964
subTotal0.43500100.0000050.05351
WireGold alloyGold (Au)7440-57-50.0134999.000001.55209
Palladium (Pd)7440-05-30.000141.000000.01568
subTotal0.01362100.000001.56777
total0.86907100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.