×

Chemical content 74LVC1G97GN

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74LVC1G97GNSOT1115X2SON60.87577 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935293187132512601235Nijmegen, Netherlands; Seremban, Malaysia; Shanghai, China; Hefei, China; Hsin-chu, Taiwan; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.03355100.000003.83114
subTotal0.03355100.000003.83114
ComponentAdditiveNon hazardousProprietary0.000255.000000.02855
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.02855
Silica -amorphous-7631-86-90.0025050.000000.28546
PolymerEpoxy resin systemProprietary0.0015030.000000.17128
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.05709
subTotal0.00500100.000000.57093
Lead FrameCopper alloyCopper (Cu)7440-50-80.3638694.5100041.54784
Magnesium (Mg)7439-95-40.000580.150000.06594
Nickel (Ni)7440-02-00.011362.950001.29686
Silicon (Si)7440-21-30.002460.640000.28135
Pure metal layerGold (Au)7440-57-50.000080.020000.00879
Nickel (Ni)7440-02-00.006311.640000.72097
Palladium (Pd)7440-05-30.000350.090000.03957
subTotal0.38500100.0000043.96132
Mould CompoundAdditiveNon hazardousProprietary0.001780.410000.20365
FillerSilica -amorphous-7631-86-90.001260.290000.14404
Silica fused60676-86-00.3747586.1500042.79120
HardenerPhenolic resinProprietary0.018664.290002.13087
PigmentCarbon black1333-86-40.000830.190000.09437
PolymerEpoxy resin systemProprietary0.037718.670004.30644
subTotal0.43500100.0000049.67057
WireGold alloyGold (Au)7440-57-50.0170599.000001.94661
Palladium (Pd)7440-05-30.000171.000000.01966
subTotal0.01722100.000001.96627
total0.87577100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.