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Chemical content 74LVC1GU04GN

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Type numberPackagePackage descriptionTotal product weight
74LVC1GU04GNSOT1115X2SON60.86104 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935291795132612601235Bangkok, Thailand; Nijmegen, Netherlands; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.02562100.000002.97579
subTotal0.02562100.000002.97579
ComponentAdditiveNon hazardousProprietary0.000255.000000.02903
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.02903
Silica -amorphous-7631-86-90.0025050.000000.29035
PolymerEpoxy resin systemProprietary0.0015030.000000.17421
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.05807
subTotal0.00500100.000000.58069
Lead FrameCopper alloyCopper (Cu)7440-50-80.3638694.5100042.25861
Magnesium (Mg)7439-95-40.000580.150000.06707
Nickel (Ni)7440-02-00.011362.950001.31904
Silicon (Si)7440-21-30.002460.640000.28617
Pure metal layerGold (Au)7440-57-50.000080.020000.00894
Nickel (Ni)7440-02-00.006311.640000.73330
Palladium (Pd)7440-05-30.000350.090000.04024
subTotal0.38500100.0000044.71337
Mould CompoundAdditiveNon hazardousProprietary0.001780.410000.20713
FillerSilica -amorphous-7631-86-90.001260.290000.14651
Silica fused60676-86-00.3747586.1500043.52324
HardenerPhenolic resinProprietary0.018664.290002.16732
PigmentCarbon black1333-86-40.000830.190000.09599
PolymerEpoxy resin systemProprietary0.037718.670004.38011
subTotal0.43500100.0000050.52030
WireGold alloyGold (Au)7440-57-50.0103199.000001.19749
Palladium (Pd)7440-05-30.000101.000000.01210
subTotal0.01042100.000001.20959
total0.86104100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.