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Chemical content 74LVC1GU04GW-Q100

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Type numberPackagePackage descriptionTotal product weight
74LVC1GU04GW-Q100SOT353-1UMT55.65784 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935301619125612601235Nijmegen, Netherlands; Bangkok, Thailand; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0072975.000000.12885
PolymerResin systemProprietary0.0024325.000000.04295
subTotal0.00972100.000000.17180
DieDoped siliconSilicon (Si)7440-21-30.06833100.000001.20766
subTotal0.06833100.000001.20766
Lead FrameCopper alloyCopper (Cu)7440-50-81.9077596.8400033.71866
Iron (Fe)7439-89-60.045512.310000.80432
Lead (Pb)7439-92-10.000200.010000.00348
Phosphorus (P)7723-14-00.001380.070000.02437
Zinc (Zn)7440-66-60.002360.120000.04178
Pure metal layerSilver (Ag)7440-22-40.012800.650000.22632
subTotal1.97000100.0000034.81893
Mould CompoundFillerSilica -amorphous-7631-86-90.4606014.000008.14092
Silica fused60676-86-02.3217570.5700041.03603
PigmentCarbon black1333-86-40.006580.200000.11630
PolymerEpoxy resin systemProprietary0.305649.290005.40208
Phenolic resinProprietary0.195435.940003.45407
subTotal3.29000100.0000058.14940
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00016
Bismuth (Bi)7440-69-90.000000.001000.00005
Copper (Cu)7440-50-80.000000.001000.00005
Lead (Pb)7439-92-10.000020.005000.00027
Tin solderTin (Sn)7440-31-50.3099799.990005.47857
subTotal0.31000100.000005.47910
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalCopper (Cu)7440-50-80.0097999.990000.17305
subTotal0.00979100.000000.17307
total5.65784100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.