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Chemical content 74LVC2G14GN

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Type numberPackagePackage descriptionTotal product weight
74LVC2G14GNSOT1115X2SON60.88487 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935291802132612601235Bangkok, Thailand; Shanghai, China; Hefei, China; Hsin-chu, Taiwan; Seremban, Malaysia; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.04528100.000005.11680
subTotal0.04528100.000005.11680
ComponentAdditiveNon hazardousProprietary0.000255.000000.02825
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.02825
Silica -amorphous-7631-86-90.0025050.000000.28253
PolymerEpoxy resin systemProprietary0.0015030.000000.16952
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.05651
subTotal0.00500100.000000.56506
Lead FrameCopper alloyCopper (Cu)7440-50-80.3638694.5100041.12056
Magnesium (Mg)7439-95-40.000580.150000.06526
Nickel (Ni)7440-02-00.011362.950001.28352
Silicon (Si)7440-21-30.002460.640000.27846
Pure metal layerGold (Au)7440-57-50.000080.020000.00870
Nickel (Ni)7440-02-00.006311.640000.71355
Palladium (Pd)7440-05-30.000350.090000.03916
subTotal0.38500100.0000043.50921
Mould CompoundAdditiveNon hazardousProprietary0.001780.410000.20156
FillerSilica -amorphous-7631-86-90.001260.290000.14256
Silica fused60676-86-00.3747586.1500042.35114
HardenerPhenolic resinProprietary0.018664.290002.10895
PigmentCarbon black1333-86-40.000830.190000.09340
PolymerEpoxy resin systemProprietary0.037718.670004.26215
subTotal0.43500100.0000049.15976
WireGold alloyGold (Au)7440-57-50.0144599.000001.63290
Palladium (Pd)7440-05-30.000151.000000.01649
subTotal0.01460100.000001.64939
total0.88487100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.