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Chemical content BAS21LL

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Type numberPackagePackage descriptionTotal product weight
BAS21LLSOD882DFN1006-20.94168 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934071228315212601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0076076.000000.80707
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0010510.470000.11118
Phenolic resinProprietary0.0013513.530000.14368
subTotal0.01000100.000001.06193
DieDoped siliconSilicon (Si)7440-21-30.04000100.000004.24773
subTotal0.04000100.000004.24773
Lead FrameCopper alloyCopper (Cu)7440-50-80.3874194.4900041.14020
Magnesium (Mg)7439-95-40.000820.200000.08708
Nickel (Ni)7440-02-00.012923.150001.37149
Silicon (Si)7440-21-30.002830.690000.30042
Pure metal layerGold (Au)7440-57-50.000120.030000.01306
Nickel (Ni)7440-02-00.005211.270000.55295
Palladium (Pd)7440-05-30.000700.170000.07402
subTotal0.41000100.0000043.53922
Mould CompoundFillerSilica -amorphous-7631-86-90.1035023.0000010.99099
Silica fused60676-86-00.2700060.0000028.67216
Flame retardantMetal hydroxideProprietary0.013503.000001.43361
ImpurityBismuth (Bi)7440-69-90.002250.500000.23893
PigmentCarbon black1333-86-40.002250.500000.23893
PolymerEpoxy resin systemProprietary0.031507.000003.34509
Phenolic resinProprietary0.027006.000002.86722
subTotal0.45000100.0000047.78693
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00010
Non hazardousProprietary0.000010.055500.00118
Tin solderTin (Sn)7440-31-50.0199999.940002.12259
subTotal0.02000100.000002.12387
WireImpurityNon hazardousProprietary0.000000.010000.00012
Pure metalGold (Au)7440-57-50.0116899.990001.24021
subTotal0.01168100.000001.24033
total0.94168100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.