×

Chemical content BAS70VV

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BAS70VVSOT666SOT62.14189 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340587421151412601235Seremban, Malaysia; Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.06000100.000002.80126
subTotal0.06000100.000002.80126
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.000800.080000.03735
Carbon (C)7440-44-00.000400.040000.01868
Chromium (Cr)7440-47-30.002100.210000.09804
Cobalt (Co)7440-48-40.004200.420000.19609
Iron (Fe)7439-89-60.4686046.8600021.87787
Manganese (Mn)7439-96-50.008400.840000.39218
Nickel (Ni)7440-02-00.3529035.2900016.47610
Phosphorus (P)7723-14-00.000200.020000.00934
Silicon (Si)7440-21-30.002500.250000.11672
Sulphur (S)7704-34-90.000200.020000.00934
Pure metal layerCopper (Cu)7440-50-80.1296012.960006.05073
Silver (Ag)7440-22-40.030103.010001.40530
subTotal1.00000100.0000046.68774
Mould CompoundFillerSilica fused60676-86-00.7100071.0000033.14829
PigmentCarbon black1333-86-40.003000.300000.14006
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.1970019.700009.19748
Phenolic resinProprietary0.090009.000004.20190
subTotal1.00000100.0000046.68773
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00009
Bismuth (Bi)7440-69-90.000000.001000.00003
Copper (Cu)7440-50-80.000000.001000.00003
Lead (Pb)7439-92-10.000000.005000.00015
Tin solderTin (Sn)7440-31-50.0637299.990002.97493
subTotal0.06373100.000002.97523
WireImpurityNon hazardousProprietary0.000000.010000.00008
Pure metalGold (Au)7440-57-50.0181699.990000.84776
subTotal0.01816100.000000.84784
total2.14189100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.