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Chemical content BAS70VY-Q

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Type numberPackagePackage descriptionTotal product weight
BAS70VY-QSOT363SC-885.47637 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934665758115212601235D-22529 HAMBURG, Germany; Dongguan, China; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.09000100.000001.64342
subTotal0.09000100.000001.64342
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.002070.100000.03780
Carbon (C)7440-44-00.001040.050000.01890
Chromium (Cr)7440-47-30.005180.250000.09450
Cobalt (Co)7440-48-40.010350.500000.18899
Iron (Fe)7439-89-61.1426455.2000020.86492
Manganese (Mn)7439-96-50.020701.000000.37799
Nickel (Ni)7440-02-00.8607141.5800015.71672
Phosphorus (P)7723-14-00.000620.030000.01134
Silicon (Si)7440-21-30.006210.300000.11340
Sulphur (S)7704-34-90.000620.030000.01134
Pure metal layerCopper (Cu)7440-50-80.017390.840000.31751
Silver (Ag)7440-22-40.002480.120000.04536
subTotal2.07000100.0000037.79877
Mould CompoundFillerSilica fused60676-86-02.2079475.1000040.31758
PigmentCarbon black1333-86-40.008820.300000.16106
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.5145017.500009.39491
Phenol Formaldehyde resin (generic)9003-35-40.208747.100003.81165
subTotal2.94000100.0000053.68520
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00020
Bismuth (Bi)7440-69-90.000000.001000.00007
Copper (Cu)7440-50-80.000000.001000.00007
Lead (Pb)7439-92-10.000020.005000.00034
Tin solderTin (Sn)7440-31-50.3699699.990006.75562
subTotal0.37000100.000006.75630
WirePure metalCopper (Cu)7440-50-80.00637100.000000.11631
subTotal0.00637100.000000.11631
total5.47637100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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