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Chemical content LSF0102GS

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Type numberPackagePackage descriptionTotal product weight
LSF0102GSSOT1203X2SON81.33974 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935691115115512601235Seremban, Malaysia; Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.04552100.000003.39759
subTotal0.04552100.000003.39759
ComponentAdditiveNon hazardousProprietary0.000305.000000.02239
FillerBisphenol A-epichlorohydrin resin25068-38-60.000305.000000.02239
Silica -amorphous-7631-86-90.0030050.000000.22392
PolymerEpoxy resin systemProprietary0.0018030.000000.13435
Phenol Formaldehyde resin (generic)9003-35-40.0006010.000000.04478
subTotal0.00600100.000000.44783
Lead FrameCopper alloyCopper (Cu)7440-50-80.5443894.5100040.63308
Magnesium (Mg)7439-95-40.000860.150000.06449
Nickel (Ni)7440-02-00.016992.950001.26831
Silicon (Si)7440-21-30.003690.640000.27516
Pure metal layerGold (Au)7440-57-50.000120.020000.00860
Nickel (Ni)7440-02-00.009451.640000.70509
Palladium (Pd)7440-05-30.000520.090000.03869
subTotal0.57600100.0000042.99342
Mould CompoundAdditiveNon hazardousProprietary0.002800.410000.20902
FillerSilica -amorphous-7631-86-90.001980.290000.14784
Silica fused60676-86-00.5884086.1500043.91931
HardenerPhenolic resinProprietary0.029304.290002.18704
PigmentCarbon black1333-86-40.001300.190000.09686
PolymerEpoxy resin systemProprietary0.059228.670004.41997
subTotal0.68300100.0000050.98004
WireGold alloyGold (Au)7440-57-50.0289399.000002.15921
Palladium (Pd)7440-05-30.000291.000000.02181
subTotal0.02922100.000002.18102
total1.33974100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.