×

Chemical content NEH2000BY

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
NEH2000BYSOT8076-1HWQFN1620.79710 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935691544118312601235Ayutthaya, Thailand; Leuven, Belgium; Hsinchu, Taiwan 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.005975.000000.02869
FillerAluminium Trioxide (Al2O3)1344-28-10.0477440.000000.22955
PolymerBisphenol A-epichlorohydrin resin25068-38-60.0119410.000000.05739
Bisphenol-A Bisphenol-A Diglycidyl Ether copolymer25036-25-30.0179015.000000.08608
Resin systemProprietary0.0358030.000000.17216
subTotal0.11935100.000000.57387
DieDoped siliconSilicon (Si)7440-21-31.29958100.000006.24886
subTotal1.29958100.000006.24886
Lead FrameCopper alloyCopper (Cu)7440-50-88.9343096.0923342.95935
Iron (Fe)7439-89-60.215432.317041.03586
Phosphorus (P)7723-14-00.007530.080990.03621
Zinc (Zn)7440-66-60.011440.123040.05501
ImpurityLead (Pb)7439-92-10.000840.009030.00404
Pure metal layerGold (Au)7440-57-50.002560.027530.01231
Nickel (Ni)7440-02-00.118961.279470.57200
Palladium (Pd)7440-05-30.004560.049040.02192
Silver (Ag)7440-22-40.002000.021510.00962
subTotal9.29762100.0000044.70632
Mould CompoundFillerSilica fused60676-86-08.4239284.0000040.50528
PigmentCarbon black1333-86-40.050140.500000.24110
PolymerEpoxy resin systemProprietary1.5544115.500007.47419
subTotal10.02848100.0000048.22057
WireCopper alloyCalcium (Ca)7440-70-20.000000.003000.00001
Copper (Cu)7440-50-80.0502696.537000.24168
Phosphorus (P)7723-14-00.000010.010000.00003
Pure metal layerGold (Au)7440-57-50.000230.450000.00113
Palladium (Pd)7440-05-30.001563.000000.00751
subTotal0.05207100.000000.25036
total20.79710100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.