Chemical content NEX5208000BY

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

12NC	OPN	Type No.	Package	State	MSL
935692282518	NEX5208000BYY	NEX5208000BY	SOT8041-2 (HWQFN24)	RFS	3

REACH	Compliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHS	Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHS	Compliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELV	Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFAS	Does not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65	Contains California Proposition 65 substance(s) [at the article level]: substance 1333-86-4: 2143 ppm; substance 7439-92-1: <1 ppm;
IEC 62474	Contains IEC 62474 substance(s) [at the article level]: substance 1333-86-4: 2143 ppm; substance 7439-92-1: <1 ppm; substance 7440-43-9: <1 ppm;
Precious Metals	Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 24160 ppm; substance 7440-05-3: 44 ppm; substance 7440-57-5: 4 ppm;
RHF Indicator	Lead-free and halogen-free according to Nexperia's halogen-free definition.

Material	Material Group	Substance	CAS No.	Mass (mg)	Material (%)	Product (%)
Adhesive	Filler	Silver (Ag)	7440-22-4	0.372362	77.900000	1.007795
Adhesive	Polymer	Acrylic resin		0.072656	15.200000	0.196643
Adhesive	Polymer	Resin system		0.032982	6.900000	0.089265
		Adhesive Total		0.478000	100.000000	1.293703

Die	Doped silicon	Silicon (Si)	7440-21-3	2.106624	99.840000	5.701561
Die	Pure metal	Titanium (Ti)	7440-32-6	0.000422	0.020000	0.001142
Die	Pure metal layer	Tungsten (W)	7440-33-7	0.001266	0.060000	0.003426
		Die Metallization 1 Total		0.001266	0.060000	0.003426
Die	Pure metal layer	Aluminium (Al)	7429-90-5	0.001688	0.080000	0.004569
		Die Metallization 2 Total		0.001688	0.080000	0.004569
		Die Total		2.110000	100.000000	5.710698

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	16.390080	94.500000	44.359617
Lead Frame	Copper alloy	Iron (Fe)	7439-89-6	0.402381	2.320000	1.089041
Lead Frame	Copper alloy	Zinc (Zn)	7440-66-6	0.017344	0.100000	0.046941
Lead Frame	Copper alloy	Phosphorus (P)	7723-14-0	0.013875	0.080000	0.037553
		Base Alloy Total		16.823680	97.000000	45.533152
Lead Frame	Pure metal layer	Silver (Ag)	7440-22-4	0.520320	3.000000	1.408242
		Pre-Plating Total		0.520320	3.000000	1.408242
		Lead Frame Total		17.344000	100.000000	46.941394

Mould Compound	Filler	Silica fused	60676-86-0	13.860000	87.500000	37.511976
Mould Compound	Filler	Silica	7631-86-9	0.950400	6.000000	2.572250
Mould Compound	Polymer	Epoxy resin system		0.633600	4.000000	1.714833
Mould Compound	Polymer	Phenolic resin		0.316800	2.000000	0.857417
Mould Compound	Pigment	Carbon black	1333-86-4	0.079200	0.500000	0.214354
		Mould Compound Total		15.840000	100.000000	42.870830

Post-Plating	Tin alloy	Tin (Sn)	7440-31-5	1.094484	99.952900	2.962212
Post-Plating	Impurity	Bismuth (Bi)	7440-69-9	0.000164	0.015000	0.000444
Post-Plating	Impurity	Antimony (Sb)	7440-36-0	0.000105	0.009600	0.000284
Post-Plating	Impurity	Copper (Cu)	7440-50-8	0.000088	0.008000	0.000238
Post-Plating	Impurity	Iron (Fe)	7439-89-6	0.000077	0.007000	0.000208
Post-Plating	Impurity	Arsenic (As)	7440-38-2	0.000028	0.002500	0.000076
Post-Plating	Impurity	Lead (Pb)	7439-92-1	0.000027	0.002500	0.000073
Post-Plating	Impurity	Aluminium (Al)	7429-90-5	0.000011	0.001000	0.000030
Post-Plating	Impurity	Zinc (Zn)	7440-66-6	0.000011	0.001000	0.000030
Post-Plating	Impurity	Cadmium (Cd)	7440-43-9	0.000005	0.000500	0.000013
		Post-Plating Total		1.095000	100.000000	2.963608

Wire	Pure metal	Copper (Cu)	7440-50-8	0.079332	97.700000	0.214711
Wire	Impurity	Non-declarable		0.000082	0.100000	0.000222
Wire	Pure metal layer	Palladium (Pd)	7440-05-3	0.001624	2.000000	0.004395
		Wire Coating 1 Total		0.001624	2.000000	0.004395
Wire	Pure metal layer	Gold (Au)	7440-57-5	0.000162	0.200000	0.000439
		Wire Coating 2 Total		0.000162	0.200000	0.000439
		Wire Total		0.081200	100.000000	0.219767

		NEX5208000BY Total		36.948200		100.000000

Notes
Report created on 2025-06-02 12:36:41 CEST+0200

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Pb-free Soldering		Pb Soldering		No. of Processing Cycles
PPT	MPPT	PPT	MPPT	No. of Processing Cycles
260 °C	40 s	235 °C	30 s	3

Notes
Report created on 2025-06-02 12:36:41 CEST+0200

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

部件名称 Material	有毒或有害物质和元素 (Toxic or hazardous substances and elements)
部件名称 Material	铅 (Pb)	镉 (Cd)	汞 (Hg)	六价铬 (Cr⁶⁺)	多溴联苯 (PBB)	多溴二苯醚 (PBDE)
胶黏剂 (Adhesive)	◯	◯	◯	◯	◯	◯
半导体芯片 (Die)	◯	◯	◯	◯	◯	◯
半导体芯片金属化层1 (Die Metallization 1)	◯	◯	◯	◯	◯	◯
半导体芯片金属化层2 (Die Metallization 2)	◯	◯	◯	◯	◯	◯
基底合金 (Base Alloy)	◯	◯	◯	◯	◯	◯
预镀层 (Pre-Plating)	◯	◯	◯	◯	◯	◯
模封料 (Mould Compound)	◯	◯	◯	◯	◯	◯
后镀层 (Post-Plating)	◯	◯	◯	◯	◯	◯
导线 (Wire)	◯	◯	◯	◯	◯	◯
导线涂层1 (Wire Coating 1)	◯	◯	◯	◯	◯	◯
导线涂层2 (Wire Coating 2)	◯	◯	◯	◯	◯	◯

◯	表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 规定的限量要求以下 Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
✕	表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 规定的限量要求 Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
	该半导体产品具有无限期的环保使用期限（EFUP）。 This semiconductor product has an indefinite environmental friendly use period (EFUP).

Notes
Report created on 2025-06-02 12:36:41 CEST+0200

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.

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Chemical content NEX5208000BY

Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content NEX5208000BY