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Chemical content NX3008CBKS

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Type numberPackagePackage descriptionTotal product weight
NX3008CBKSSOT363SC-885.44909 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934065639115512601235Kyoto, Japan; Dongguan, China; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieAluminium alloyAluminium (Al)7429-90-50.001022.540000.01865
Doped siliconSilicon (Si)7440-21-30.0364191.030000.66822
Gold alloyGold (Au)7440-57-50.002576.430000.04720
subTotal0.04000100.000000.73407
DieAluminium alloyAluminium (Al)7429-90-50.001022.540000.01865
Doped siliconSilicon (Si)7440-21-30.0364191.030000.66822
Gold alloyGold (Au)7440-57-50.002576.430000.04720
subTotal0.04000100.000000.73407
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.001860.090000.03419
Carbon (C)7440-44-00.000830.040000.01520
Chromium (Cr)7440-47-30.004350.210000.07977
Cobalt (Co)7440-48-40.008900.430000.16335
Iron (Fe)7439-89-60.9811847.4000018.00631
Manganese (Mn)7439-96-50.017600.850000.32290
Nickel (Ni)7440-02-00.7392035.7100013.56551
Phosphorus (P)7723-14-00.000410.020000.00760
Silicon (Si)7440-21-30.005380.260000.09877
Sulphur (S)7704-34-90.000410.020000.00760
Pure metal layerCopper (Cu)7440-50-80.2713813.110004.98023
Silver (Ag)7440-22-40.038501.860000.70658
subTotal2.07000100.0000037.98801
Mould CompoundAdditiveNon hazardousProprietary0.084682.900001.55402
Triphenylphosphine603-35-00.001460.050000.02679
FillerSilica -amorphous-7631-86-92.1024072.0000038.58259
PigmentCarbon black1333-86-40.001460.050000.02679
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.4380015.000008.03804
Phenol Formaldehyde resin (generic)9003-35-40.2920010.000005.35869
subTotal2.92000100.0000053.58692
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00020
Bismuth (Bi)7440-69-90.000000.001000.00007
Copper (Cu)7440-50-80.000000.001000.00007
Lead (Pb)7439-92-10.000020.005000.00034
Tin solderTin (Sn)7440-31-50.3699699.990006.78945
subTotal0.37000100.000006.79013
WirePure metalCopper (Cu)7440-50-80.00909100.000000.16680
subTotal0.00909100.000000.16680
total5.44909100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.