×

Chemical content NX6008NBKS

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
NX6008NBKSSOT363SC-885.73983 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934662515115312601235D-22529 HAMBURG, Germany; Dongguan, China; Seremban, Malaysia; Hsin-chu, Taiwan 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.37000100.000006.44618
subTotal0.37000100.000006.44618
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.001860.090000.03246
Carbon (C)7440-44-00.000830.040000.01443
Chromium (Cr)7440-47-30.004350.210000.07573
Cobalt (Co)7440-48-40.008900.430000.15507
Iron (Fe)7439-89-60.9811847.4000017.09423
Manganese (Mn)7439-96-50.017600.850000.30654
Nickel (Ni)7440-02-00.7392035.7100012.87838
Phosphorus (P)7723-14-00.000410.020000.00721
Silicon (Si)7440-21-30.005380.260000.09377
Sulphur (S)7704-34-90.000410.020000.00721
Pure metal layerCopper (Cu)7440-50-80.2713813.110004.72796
Silver (Ag)7440-22-40.038501.860000.67079
subTotal2.07000100.0000036.06378
Mould CompoundAdditiveNon hazardousProprietary0.084682.900001.47531
Triphenylphosphine603-35-00.001460.050000.02544
FillerSilica -amorphous-7631-86-92.1024072.0000036.62826
PigmentCarbon black1333-86-40.001460.050000.02544
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.4380015.000007.63089
Phenol Formaldehyde resin (generic)9003-35-40.2920010.000005.08726
subTotal2.92000100.0000050.87260
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00019
Bismuth (Bi)7440-69-90.000000.001000.00006
Copper (Cu)7440-50-80.000000.001000.00006
Lead (Pb)7439-92-10.000020.005000.00032
Tin solderTin (Sn)7440-31-50.3699699.990006.44554
subTotal0.37000100.000006.44617
WirePure metalCopper (Cu)7440-50-80.00983100.000000.17133
subTotal0.00983100.000000.17133
total5.73983100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.