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Chemical content NX6020CAKS

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Type numberPackagePackage descriptionTotal product weight
NX6020CAKSSOT363SC-885.43931 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934660274125112601235Seremban, Malaysia; Kyoto, Japan; Dongguan, China 
934660274115312601235Dongguan, China; Kyoto, Japan; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieAluminium alloyAluminium (Al)7429-90-50.001022.540000.01868
Doped siliconSilicon (Si)7440-21-30.0364191.030000.66942
Gold alloyGold (Au)7440-57-50.002576.430000.04729
subTotal0.04000100.000000.73539
DieAluminium alloyAluminium (Al)7429-90-50.000501.680000.00927
Doped siliconSilicon (Si)7440-21-30.0277492.470000.51001
Silver alloySilver (Ag)7440-22-40.001765.850000.03227
subTotal0.03000100.000000.55155
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.001860.090000.03425
Carbon (C)7440-44-00.000830.040000.01522
Chromium (Cr)7440-47-30.004350.210000.07992
Cobalt (Co)7440-48-40.008900.430000.16364
Iron (Fe)7439-89-60.9811847.4000018.03869
Manganese (Mn)7439-96-50.017600.850000.32348
Nickel (Ni)7440-02-00.7392035.7100013.58990
Phosphorus (P)7723-14-00.000410.020000.00761
Silicon (Si)7440-21-30.005380.260000.09895
Sulphur (S)7704-34-90.000410.020000.00761
Pure metal layerCopper (Cu)7440-50-80.2713813.110004.98918
Silver (Ag)7440-22-40.038501.860000.70785
subTotal2.07000100.0000038.05630
Mould CompoundAdditiveNon hazardousProprietary0.084682.900001.55682
Triphenylphosphine603-35-00.001460.050000.02684
FillerSilica -amorphous-7631-86-92.1024072.0000038.65196
PigmentCarbon black1333-86-40.001460.050000.02684
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.4380015.000008.05249
Phenol Formaldehyde resin (generic)9003-35-40.2920010.000005.36833
subTotal2.92000100.0000053.68328
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00020
Bismuth (Bi)7440-69-90.000000.001000.00007
Copper (Cu)7440-50-80.000000.001000.00007
Lead (Pb)7439-92-10.000020.005000.00034
Tin solderTin (Sn)7440-31-50.3699699.990006.80165
subTotal0.37000100.000006.80233
WirePure metalCopper (Cu)7440-50-80.00931100.000000.17121
subTotal0.00931100.000000.17121
total5.43931100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.