Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PBHV8115Z-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PBHV8115Z-QSOT223SC-73102.746427 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346665291151126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.10010077.0000000.097424
PolymerResin systemProprietary0.02990023.0000000.029101
subTotal0.130000100.0000000.126525
DieDoped siliconSilicon (Si)7440-21-30.440000100.0000000.428239
subTotal0.440000100.0000000.428239
Lead FrameCopper alloyCopper (Cu)7440-50-850.72514099.15000049.369250
Iron (Fe)7439-89-60.0511600.1000000.049792
Phosphorus (P)7723-14-00.0153480.0300000.014938
Pure metal layerSilver (Ag)7440-22-40.3683520.7200000.358506
subTotal51.160000100.00000049.792486
Mould CompoundAdditiveNon hazardousProprietary1.4149102.9000001.377089
Triphenylphosphine603-35-00.0243950.0500000.023743
FillerSilica -amorphous-7631-86-935.12880072.00000034.189802
PigmentCarbon black1333-86-40.0243950.0500000.023743
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-27.31850015.0000007.122875
Phenol Formaldehyde resin (generic)9003-35-44.87900010.0000004.748584
subTotal48.790000100.00000047.485836
Post-PlatingImpurityLead (Pb)7439-92-10.0000990.0045000.000097
Non hazardousProprietary0.0012270.0555000.001194
Tin solderTin (Sn)7440-31-52.20867499.9400002.149636
subTotal2.210000100.0000002.150926
WirePure metalCopper (Cu)7440-50-80.016427100.0000000.015988
subTotal0.016427100.0000000.015988
total102.746427100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.