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Chemical content PBSS4160PANPS

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Type numberPackagePackage descriptionTotal product weight
PBSS4160PANPSSOT1118D dummy POVHUSON67.07460 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934069001115412601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000781.000000.01103
FillerSilver (Ag)7440-22-40.0655284.000000.92613
PolymerBismaleimidodiphenylmethane resin 0.0078010.000000.11025
Isobornyl Methacrylate7534-94-30.003905.000000.05513
subTotal0.07800100.000001.10254
DieDoped siliconSilicon (Si)7440-21-30.12000100.000001.69621
subTotal0.12000100.000001.69621
DieDoped siliconSilicon (Si)7440-21-30.12000100.000001.69621
subTotal0.12000100.000001.69621
Lead FrameCopper alloyCopper (Cu)7440-50-82.5594195.1100036.17745
Magnesium (Mg)7439-95-40.005380.200000.07607
Nickel (Ni)7440-02-00.085303.170001.20579
Silicon (Si)7440-21-30.018570.690000.26246
Pure metal layerGold (Au)7440-57-50.000540.020000.00761
Nickel (Ni)7440-02-00.019910.740000.28148
Palladium (Pd)7440-05-30.001880.070000.02663
subTotal2.69100100.0000038.03749
Mould CompoundFillerSilica -amorphous-7631-86-90.8942423.0000012.64015
Silica fused60676-86-02.3328060.0000032.97430
Flame retardantMetal hydroxideProprietary0.116643.000001.64872
ImpurityBismuth (Bi)7440-69-90.019440.500000.27479
PigmentCarbon black1333-86-40.019440.500000.27479
PolymerEpoxy resin systemProprietary0.272167.000003.84700
Phenolic resinProprietary0.233286.000003.29743
subTotal3.88800100.0000054.95718
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00129
Tin solderTin (Sn)7440-31-50.1639099.940002.31676
subTotal0.16400100.000002.31815
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalGold (Au)7440-57-50.0136099.990000.19222
subTotal0.01360100.000000.19224
total7.07460100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.