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Chemical content PBSS4220PANS

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Type numberPackagePackage descriptionTotal product weight
PBSS4220PANSdummy POV SOT1118DHUSON67.27770 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934069679115312601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000781.000000.01072
FillerSilver (Ag)7440-22-40.0655284.000000.90028
PolymerBismaleimidodiphenylmethane resin 0.0078010.000000.10718
Isobornyl Methacrylate7534-94-30.003905.000000.05359
subTotal0.07800100.000001.07177
DieDoped siliconSilicon (Si)7440-21-30.38000100.000005.22143
subTotal0.38000100.000005.22143
Lead FrameCopper alloyCopper (Cu)7440-50-82.5594195.1100035.16784
Magnesium (Mg)7439-95-40.005380.200000.07395
Nickel (Ni)7440-02-00.085303.170001.17214
Silicon (Si)7440-21-30.018570.690000.25513
Pure metal layerGold (Au)7440-57-50.000540.020000.00740
Nickel (Ni)7440-02-00.019910.740000.27362
Palladium (Pd)7440-05-30.001880.070000.02588
subTotal2.69100100.0000036.97596
Mould CompoundFillerSilica -amorphous-7631-86-90.8942423.0000012.28740
Silica fused60676-86-02.3328060.0000032.05408
Flame retardantMetal hydroxideProprietary0.116643.000001.60270
ImpurityBismuth (Bi)7440-69-90.019440.500000.26712
PigmentCarbon black1333-86-40.019440.500000.26712
PolymerEpoxy resin systemProprietary0.272167.000003.73964
Phenolic resinProprietary0.233286.000003.20541
subTotal3.88800100.0000053.42347
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00125
Tin solderTin (Sn)7440-31-50.1639099.940002.25211
subTotal0.16400100.000002.25346
WireImpurityNon hazardousProprietary0.000010.010000.00011
Pure metalGold (Au)7440-57-50.0767099.990001.05385
subTotal0.07670100.000001.05396
total7.27770100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.