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Chemical content PBSS5255PAPS

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Type numberPackagePackage descriptionTotal product weight
PBSS5255PAPSSOT1118DHUSON67.27825 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934069681115312601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000781.000000.01072
FillerSilver (Ag)7440-22-40.0655284.000000.90022
PolymerBismaleimidodiphenylmethane resin 0.0078010.000000.10717
Isobornyl Methacrylate7534-94-30.003905.000000.05358
subTotal0.07800100.000001.07169
DieDoped siliconSilicon (Si)7440-21-30.38000100.000005.22104
subTotal0.38000100.000005.22104
Lead FrameCopper alloyCopper (Cu)7440-50-82.5594195.1100035.16519
Magnesium (Mg)7439-95-40.005380.200000.07395
Nickel (Ni)7440-02-00.085303.170001.17205
Silicon (Si)7440-21-30.018570.690000.25511
Pure metal layerGold (Au)7440-57-50.000540.020000.00739
Nickel (Ni)7440-02-00.019910.740000.27360
Palladium (Pd)7440-05-30.001880.070000.02588
subTotal2.69100100.0000036.97317
Mould CompoundFillerSilica -amorphous-7631-86-90.8942423.0000012.28647
Silica fused60676-86-02.3328060.0000032.05166
Flame retardantMetal hydroxideProprietary0.116643.000001.60258
ImpurityBismuth (Bi)7440-69-90.019440.500000.26710
PigmentCarbon black1333-86-40.019440.500000.26710
PolymerEpoxy resin systemProprietary0.272167.000003.73936
Phenolic resinProprietary0.233286.000003.20517
subTotal3.88800100.0000053.41944
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00125
Tin solderTin (Sn)7440-31-50.1639099.940002.25194
subTotal0.16400100.000002.25329
WireImpurityNon hazardousProprietary0.000010.010000.00011
Pure metalGold (Au)7440-57-50.0772499.990001.06125
subTotal0.07725100.000001.06136
total7.27825100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.