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Chemical content PBSS5260PAPS

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Type numberPackagePackage descriptionTotal product weight
PBSS5260PAPSdummy POV SOT1118DHUSON67.27798 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934069002115212601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000781.000000.01072
FillerSilver (Ag)7440-22-40.0655284.000000.90025
PolymerBismaleimidodiphenylmethane resin 0.0078010.000000.10717
Isobornyl Methacrylate7534-94-30.003905.000000.05359
subTotal0.07800100.000001.07173
DieDoped siliconSilicon (Si)7440-21-30.38000100.000005.22123
subTotal0.38000100.000005.22123
Lead FrameCopper alloyCopper (Cu)7440-50-82.5594195.1100035.16649
Magnesium (Mg)7439-95-40.005380.200000.07395
Nickel (Ni)7440-02-00.085303.170001.17209
Silicon (Si)7440-21-30.018570.690000.25512
Pure metal layerGold (Au)7440-57-50.000540.020000.00739
Nickel (Ni)7440-02-00.019910.740000.27361
Palladium (Pd)7440-05-30.001880.070000.02588
subTotal2.69100100.0000036.97453
Mould CompoundFillerSilica -amorphous-7631-86-90.8942423.0000012.28693
Silica fused60676-86-02.3328060.0000032.05285
Flame retardantMetal hydroxideProprietary0.116643.000001.60264
ImpurityBismuth (Bi)7440-69-90.019440.500000.26711
PigmentCarbon black1333-86-40.019440.500000.26711
PolymerEpoxy resin systemProprietary0.272167.000003.73950
Phenolic resinProprietary0.233286.000003.20528
subTotal3.88800100.0000053.42142
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00125
Tin solderTin (Sn)7440-31-50.1639099.940002.25202
subTotal0.16400100.000002.25337
WireImpurityNon hazardousProprietary0.000010.010000.00011
Pure metalGold (Au)7440-57-50.0769799.990001.05755
subTotal0.07698100.000001.05766
total7.27798100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.