Bipolar transistors


ESD protection, TVS, filtering and signal conditioning





Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PBSS5260PAPS

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PBSS5260PAPSSOT1118DHUSON67.27798 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
9340690021152126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000781.000000.01072
FillerSilver (Ag)7440-22-40.0655284.000000.90025
PolymerBismaleimidodiphenylmethane resin 0.0078010.000000.10717
Isobornyl Methacrylate7534-94-30.003905.000000.05359
DieDoped siliconSilicon (Si)7440-21-30.38000100.000005.22123
Lead FrameCopper alloyCopper (Cu)7440-50-82.5594195.1100035.16649
Magnesium (Mg)7439-95-40.005380.200000.07395
Nickel (Ni)7440-02-00.085303.170001.17209
Silicon (Si)7440-21-30.018570.690000.25512
Pure metal layerGold (Au)7440-57-50.000540.020000.00739
Nickel (Ni)7440-02-00.019910.740000.27361
Palladium (Pd)7440-05-30.001880.070000.02588
Mould CompoundFillerSilica -amorphous-7631-86-90.8942423.0000012.28693
Silica fused60676-86-02.3328060.0000032.05285
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.116643.000001.60264
Ion trapping agentBismuth (Bi)7440-69-90.019440.500000.26711
PigmentCarbon black1333-86-40.019440.500000.26711
PolymerEpoxy resin systemProprietary0.272167.000003.73950
Phenolic resinProprietary0.233286.000003.20528
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00125
Tin solderTin (Sn)7440-31-50.1639099.940002.25202
WireImpurityNon hazardousProprietary0.000010.010000.00011
Pure metalGold (Au)7440-57-50.0769799.990001.05755
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.