×

Chemical content PESD2ETH-X

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PESD2ETH-XSOT143BSOT48.89855 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934070187215412601235Seremban, Malaysia; Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.10000100.000001.12378
subTotal0.10000100.000001.12378
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.003020.090000.03388
Carbon (C)7440-44-00.001340.040000.01506
Chromium (Cr)7440-47-30.007040.210000.07906
Cobalt (Co)7440-48-40.014070.420000.15812
Iron (Fe)7439-89-61.5838847.2800017.79930
Manganese (Mn)7439-96-50.028480.850000.32000
Nickel (Ni)7440-02-01.1932735.6200013.40971
Phosphorus (P)7723-14-00.000670.020000.00753
Silicon (Si)7440-21-30.008380.250000.09412
Sulphur (S)7704-34-90.000670.020000.00753
Pure metal layerCopper (Cu)7440-50-80.4381813.080004.92417
Silver (Ag)7440-22-40.071022.120000.79811
subTotal3.35000100.0000037.64659
Mould CompoundFillerSilica fused60676-86-03.5216071.0000039.57499
PigmentCarbon black1333-86-40.014880.300000.16722
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.9771219.7000010.98067
Phenolic resinProprietary0.446409.000005.01655
subTotal4.96000100.0000055.73943
Post-PlatingImpurityLead (Pb)7439-92-10.000020.004500.00024
Non hazardousProprietary0.000260.055500.00293
Tin solderTin (Sn)7440-31-50.4697299.940005.27859
subTotal0.47000100.000005.28176
WirePure metalGold (Au)7440-57-50.01855100.000000.20846
subTotal0.01855100.000000.20846
total8.89855100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.