Discover Nexperia’s extensive portfolio of essential semiconductors which enable the basic functionality of virtually every commercial electronic design in the world – from automotive and industrial to mobile and consumer applications.

All products

A wide range of bipolar transistors helps you easily fulfil your system requirements. That includes simple bipolar building blocks and a comprehensive range of space and cost saving resistor-equipped transistors right up to our Breakthrough In Small Signal series of low VCEsat devices.

Diodes

Our extensive diode portfolio offers the flexibility you need in today's market - whether it is a simple Zener, a highly efficient Schottky rectifier, a fast recovery or controlled avalanche switching diode.

ESD protection, TVS, signal conditioning

Covering ESD protection and TVS devices as well as common-mode choke and EMI filtering, Nexperia's protection technologies continue to evolve to offer the highest level of protection in the industry's smallest packages.

MOSFETs

Nexperia offers a broad portfolio of low- / middle-voltage (12-200 V) P- and N-channel silicon MOSFETs in a wide range of space-saving and efficient package options.

SiC MOSFETs

Raising the bar for safe, robust and reliable power switching, Nexperia’s 1200 V Silicon Carbide (SiC) MOSFETs are the product of choice for electric vehicle charging infrastructure, photovoltaic inverters, and motor drives.
- 1200 V SiC MOSFETs

GaN FETs

For a variety of high-voltage (650 V) and low-voltage (40-150 V) applications Nexperia GaN FETs deliver the fastest transition / switching capability , best power efficiency and enhanced power density through reduced conduction and switching losses.

IGBTs

Addressing the growing demand for efficient, high-voltage power conversion and motor drives, Nexperia's IGBTs feature a robust and cost-effective carrier stored trench-gate (CSTBT) advanced field-stop (FS) construction.
- 650 / 1200 V discrete IGBTs

Analog & Logic ICs

Alongside a comprehensive portfolio of logic functions, analog switches and I²C interface portfolio, Nexperia delivers a grwoing range of power ICs that enable innovative solutions focused on reducing our customer’s BOM cost, improving system efficiency and robustness.

Automotive

Helping enable connected electric and hybrid vehicles, Nexperia's offers fully qualified AEC-Q100/Q101 devices from across our complete portfolio of energy- and design-efficient products.

Applications

All applications

With a commitment to innovation and sustainability, our components set benchmarks in efficiency, empowering our global customer base to develop energy-efficient and cutting-edge solutions for virtually every commercial electronic design in the world.

All applications

Automotive

Today’s cars are undergoing the greatest transformation the industry has seen. Continued electrification is resulting in significant changes from the powertrain right through to the cloud with ever more electronic functionality being added to increase safety and comfort.

Industrial and Power

From industrial automation to renewable energy and e-mobility solutions, Nexperia helps keep industry running by providing proven quality and stable high-volume supply alongside lifetime reliability and product longevity.

Mobile and Wearables

Our phones are firmly ensconced in our lives – indispensable tools for information, networking, entertainment and a whole range of services from banking to calorie counting. But they need components that occupy little board space, help extend battery life and support sophisticated functionality.

Computing and Consumer

When we think of computing and consumer applications we tend to envisage laptops and washing machines. However today's applciations offer a whole swathe of new and innovative products - from robot vacuum cleaners to self-charging remote controls.

Sub-systems: Power conversion topologies

Virtually every electronic device relies on some form of power conversion. Whether it is transforming AC grid power into a DC power rail, boosting a DC battery voltage or simply handling the increasingly diverse range of power rails in today’s electronic systems.

Sub-systems: General

Any complex system can be broken down into a number of sub-systems, which can appear in a host of applications. From motor drives and power supplies to constant current sources for stable driving of LED strings, The only difference between these sub-systems are their specifications and overall efficiency.

Reference designs

Explore our extensive collection of Nexperia reference designs and third-party evaluation boards and reference designs. Leveraging the latest in semiconductor technology, they offer complete systems, subsystems, and specialized functions that seamlessly integrate into your projects.

All reference designs

Evaluation boards

Gain a deeper understanding of how our products can benefit your application, whether it's optimizing for efficiency, robustness, or reliability by simply trying one of our comprehensive range of evaluation boards for yourself.

All evaluation boards

Interactive application notes

Nexperia interactive application notes use PartQuest Explore simulations to bring traditional written application notes to life. They provide guidelines for various power designs and topologies using embedded simulations to enhance your user experience.

Advanced Support Tools

Nexperia doesn’t just develop high-performance power products and innovative power technologies. We also create the most advanced tools to provide knowledge, learning, and support for design engineers.

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Chemical content PESD5V0H1BLG-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

12NC	OPN	Type No.	Package	State	MSL
934665103303	PESD5V0H1BLG-QZ	PESD5V0H1BLG-Q	SOD882LD-1 (DFN1006LD-2)	RFS	1

REACH	Compliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHS	Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHS	Compliant with Chinese ACPEIP (Administration on the Control of Pollution Caused by Electronic Information Products) (CN RoHS) without exemptions.
ELV	Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFAS	Does not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65	Contains California Proposition 65 substance(s) [at the article level]: substance 1333-86-4: 352 ppm; substance 65997-17-3: 25115 ppm; substance 7440-02-0: 78 ppm;
IEC 62474	Contains IEC 62474 substance(s) [at the article level]: substance 1333-86-4: 352 ppm; substance 7440-02-0: 78 ppm; substance 75980-60-8: 1 ppm;
Precious Metals	Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-05-3: 1902 ppm; substance 7440-22-4: 11138 ppm; substance 7440-57-5: 511 ppm;
RHF Indicator	Lead-free and halogen-free according to Nexperia's halogen-free definition.

Material	Material Group	Substance	CAS No.	Mass (mg)	Material (%)	Product (%)
Die	Doped silicon	Silicon (Si)	7440-21-3	0.043280	78.690808	2.673803
Die	Dielectric Layer	Quartz (SiO2)	14808-60-7	0.003447	6.267050	0.212953
Die	Additive	Non-declarable		0.001575	2.864288	0.097302
		Semiconductor Substrate Total		0.048302	87.822146	2.984058
Die	Pure metal layer	Copper (Cu)	7440-50-8	0.000040	0.072356	0.002471
		Under Bump Metallization 1 Total		0.000040	0.072356	0.002471
Die	Pure metal layer	Titanium (Ti)	7440-32-6	0.000005	0.009073	0.000309
		Under Bump Metallization 2 Total		0.000005	0.009073	0.000309
Die	Pure metal	Copper (Cu)	7440-50-8	0.003982	7.239317	0.246005
		Bumping 1 Total		0.003982	7.239317	0.246005
Die	Tin alloy	Tin (Sn)	7440-31-5	0.001608	2.922962	0.099341
Die	Tin alloy	Silver (Ag)	7440-22-4	0.000029	0.053534	0.001792
		Bumping 2 Total		0.001637	2.976496	0.101133
Die	Polymer	Polyimide resin		0.001034	1.880612	0.063880
		Passivation Total		0.001034	1.880612	0.063880
		Die Total		0.055000	100.000000	3.397856

Under Bump Metallization	Pure metal layer	Copper (Cu)	7440-50-8	0.000888	88.820000	0.054860
		Under Bump Metallization 1 Total		0.000888	88.820000	0.054860
Under Bump Metallization	Pure metal layer	Titanium (Ti)	7440-32-6	0.000112	11.180000	0.006919
		Under Bump Metallization 2 Total		0.000112	11.180000	0.006919
		Under Bump Metallization Total		0.001000	100.000000	0.061779

Mould Compound	Filler	Silica fused	60676-86-0	0.062700	55.000000	3.873555
Mould Compound	Filler	Silica	7631-86-9	0.034200	30.000000	2.112848
Mould Compound	Polymer	Phenolic resin		0.006840	6.000000	0.422570
Mould Compound	Polymer	Epoxy resin system		0.006270	5.500000	0.387356
Mould Compound	Flame retardant	Aluminium hydroxide (Al(OH)3)	21645-51-2	0.003420	3.000000	0.211285
Mould Compound	Pigment	Carbon black	1333-86-4	0.000570	0.500000	0.035214
		Mould Compound Total		0.114000	100.000000	7.042828

Passivation	Polymer	Polyimide resin		0.010000	100.000000	0.617792
		Passivation Total		0.010000	100.000000	0.617792

Solder Ball	Pure metal layer	Copper (Cu)	7440-50-8	0.571429	57.142860	35.302422
Solder Ball	Pure metal layer	Tin (Sn)	7440-31-5	0.410571	41.057140	25.364744
Solder Ball	Pure metal layer	Silver (Ag)	7440-22-4	0.018000	1.800000	1.112025
		Solder Ball Total		1.000000	100.000000	61.779191

Substrate/Laminate	Pure metal layer	Nickel (Ni)	7440-02-0	0.000127	0.028890	0.007846
		Plating 1 Total		0.000127	0.028890	0.007846
Substrate/Laminate	Pure metal layer	Gold (Au)	7440-57-5	0.000827	0.188450	0.051091
		Plating 2 Total		0.000827	0.188450	0.051091
Substrate/Laminate	Pure metal layer	Palladium (Pd)	7440-05-3	0.003079	0.701890	0.190218
		Plating 3 Total		0.003079	0.701890	0.190218
Substrate/Laminate	Pure metal layer	Copper (Cu)	7440-50-8	0.000005	0.001120	0.000309
		Plating 4 Total		0.000005	0.001120	0.000309
Substrate/Laminate	Pure metal layer	Titanium (Ti)	7440-32-6	0.000041	0.009260	0.002533
		Plating 5 Total		0.000041	0.009260	0.002533
Substrate/Laminate	Pure metal layer	Copper (Cu)	7440-50-8	0.316621	72.177950	19.560589
Substrate/Laminate	Impurity	Phosphorus (P)	7723-14-0	0.000043	0.009790	0.002656
		Plating 6 Total		0.316664	72.187740	19.563245
Substrate/Laminate	Fiberglass	Glass, oxide, chemicals (fibrous)	65997-17-3	0.040653	9.267530	2.511509
Substrate/Laminate	Filler	Silica fused	60676-86-0	0.040378	9.204680	2.494520
Substrate/Laminate	Polymer	Resin system		0.019673	4.484670	1.215382
Substrate/Laminate	Impurity	Calcium fluoride	7789-75-5	0.000069	0.015770	0.004263
		Pre-preg Total		0.100773	22.972650	6.225674
Substrate/Laminate	Polymer	Acrylic resin		0.009019	2.055930	0.557187
Substrate/Laminate	Flame retardant	Barium sulfate (BaSO4)	7727-43-7	0.006260	1.427040	0.386738
Substrate/Laminate	Additive	Non-declarable		0.000994	0.226650	0.061409
Substrate/Laminate	Additive	Talc	14807-96-6	0.000736	0.167890	0.045469
Substrate/Laminate	Pigment	C.I. Pigment Blue 15	147-14-8	0.000129	0.029380	0.007970
Substrate/Laminate	Impurity	2-Benzyl-2-(dimethylamino)-1-(4-morpholinophenyl)-1-butanone	119313-12-1	0.000009	0.001970	0.000556
Substrate/Laminate	Impurity	Misc. chlorine compounds (generic)		0.000003	0.000680	0.000185
Substrate/Laminate	Impurity	(2,4,6-Trimethylbenzoyl)diphenylphosphine oxide	75980-60-8	0.000002	0.000460	0.000124
		Solder Mask Total		0.017152	3.910000	1.059638
		Substrate/Laminate Total		0.438668	100.000000	27.100554

		PESD5V0H1BLG-Q Total		1.618668		100.000000

Notes
Report created on 2026-03-08 19:19:02 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Pb-free Soldering		Pb Soldering		No. of Processing Cycles
PPT	MPPT	PPT	MPPT	No. of Processing Cycles
260 °C	40 s	235 °C	30 s	3

Notes
Report created on 2026-03-08 19:19:02 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

部件名称 Component	有毒有害物质或元素 (Toxic and hazardous substances or elements)
部件名称 Component	Pb (铅) 铅 Lead	Hg (汞) 汞 Mercury	Cd (镉) 镉 Cadmium	Cr⁶⁺ (六价铬) 六价铬 Chromium VI	PBB (多溴联苯) 多溴联苯 Polybrominated biphenyls	PBDE (多溴二苯醚) 多溴二苯醚 Polybrominated diphenyl ethers	DEHP (邻苯二甲酸二(2-乙基己)酯) 邻苯二甲酸二(2-乙基己)酯 Di(2-ethylhexyl) phthalate	BBP (邻苯二甲酸丁苄酯) 邻苯二甲酸丁苄酯 Butyl benzyl phthalate	DBP (邻苯二甲酸二丁酯) 邻苯二甲酸二丁酯 Dibutyl phthalate	DIBP (邻苯二甲酸二异丁酯) 邻苯二甲酸二异丁酯 Diisobutyl phthalate
半导体衬底 (Semiconductor Substrate)	◯	◯	◯	◯	◯	◯	◯	◯	◯	◯
底部金属层1 (Under Bump Metallization 1)	◯	◯	◯	◯	◯	◯	◯	◯	◯	◯
底部金属层2 (Under Bump Metallization 2)	◯	◯	◯	◯	◯	◯	◯	◯	◯	◯
凸块1 (Bumping 1)	◯	◯	◯	◯	◯	◯	◯	◯	◯	◯
凸块2 (Bumping 2)	◯	◯	◯	◯	◯	◯	◯	◯	◯	◯
钝化层 (Passivation)	◯	◯	◯	◯	◯	◯	◯	◯	◯	◯
底部金属层1 (Under Bump Metallization 1)	◯	◯	◯	◯	◯	◯	◯	◯	◯	◯
底部金属层2 (Under Bump Metallization 2)	◯	◯	◯	◯	◯	◯	◯	◯	◯	◯
模封料 (Mould Compound)	◯	◯	◯	◯	◯	◯	◯	◯	◯	◯
钝化层 (Passivation)	◯	◯	◯	◯	◯	◯	◯	◯	◯	◯
Solder Ball (Solder Ball)	◯	◯	◯	◯	◯	◯	◯	◯	◯	◯
镀层1 (Plating 1)	◯	◯	◯	◯	◯	◯	◯	◯	◯	◯
镀层2 (Plating 2)	◯	◯	◯	◯	◯	◯	◯	◯	◯	◯
镀层3 (Plating 3)	◯	◯	◯	◯	◯	◯	◯	◯	◯	◯
镀层4 (Plating 4)	◯	◯	◯	◯	◯	◯	◯	◯	◯	◯
镀层5 (Plating 5)	◯	◯	◯	◯	◯	◯	◯	◯	◯	◯
镀层6 (Plating 6)	◯	◯	◯	◯	◯	◯	◯	◯	◯	◯
黏合胶片 (Pre-preg)	◯	◯	◯	◯	◯	◯	◯	◯	◯	◯
防焊绿漆 (Solder Mask)	◯	◯	◯	◯	◯	◯	◯	◯	◯	◯

◯	表示该有害物质在该部件的所有均质材料中的含量均符合 GB/T 26572 规定的限量要求。 Indicates that the content of the hazardous substance in all homogeneous materials of this part complies with the limit requirements of GB/T 26572.
✕	表示该有害物质在该部件的至少一种均质材料中的含量超过 GB/T 26572 规定的限量要求（如适用，符合相关豁免要求）。 Indicates that the content of the hazardous substance in at least one homogeneous material of this part exceeds the limit requirements of GB/T 26572 (where applicable, in accordance with relevant exemptions).
	该半导体产品符合中国 RoHS 要求，适用"e"标识，环境保护使用期限（EFUP）标识不适用。 This semiconductor product complies with China RoHS requirements and bears the "e" mark; therefore, the Environmental Friendly Use Period (EFUP) marking is not applicable. 注：EFUP 的确定基于产品在正常使用条件下的环境与可靠性评估。 Note: The EFUP is determined based on environmental and reliability assessments under normal operating conditions.

Notes
Report created on 2026-03-08 19:19:02 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.

Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PESD5V0H1BLG-Q