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Chemical content PESD5V0X2UAM

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Type numberPackagePackage descriptionTotal product weight
PESD5V0X2UAMSOT883XQFN30.87666 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934068182315312601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0076076.000000.86693
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0010510.470000.11943
Phenolic resinProprietary0.0013513.530000.15434
subTotal0.01000100.000001.14070
DieDoped siliconSilicon (Si)7440-21-30.05000100.000005.70347
subTotal0.05000100.000005.70347
Lead FrameCopper alloyCopper (Cu)7440-50-80.4016693.4100045.81742
Magnesium (Mg)7439-95-40.000630.146000.07161
Nickel (Ni)7440-02-00.012532.913001.42882
Silicon (Si)7440-21-30.002710.631000.30950
MetallisationGold (Au)7440-57-50.000150.035000.01717
Nickel (Ni)7440-02-00.011852.755001.35132
Palladium (Pd)7440-05-30.000470.110000.05395
subTotal0.43000100.0000049.04979
Mould CompoundFillerSilica -amorphous-7631-86-90.0851023.000009.70730
Silica fused60676-86-00.2220060.0000025.32339
Flame retardantMetal hydroxideProprietary0.011103.000001.26617
ImpurityBismuth (Bi)7440-69-90.001850.500000.21103
PigmentCarbon black1333-86-40.001850.500000.21103
PolymerEpoxy resin systemProprietary0.025907.000002.95440
Phenolic resinProprietary0.022206.000002.53234
subTotal0.37000100.0000042.20566
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00005
Non hazardousProprietary0.000010.055500.00063
Tin solderTin (Sn)7440-31-50.0099999.940001.14001
subTotal0.01000100.000001.14069
WireImpurityNon hazardousProprietary0.000000.010000.00008
Pure metalGold (Au)7440-57-50.0066599.990000.75907
subTotal0.00666100.000000.75915
total0.87666100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.