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Chemical content PESD5V0X2UAMB

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Type numberPackagePackage descriptionTotal product weight
PESD5V0X2UAMBSOT883BXQFN30.70017 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934068184315412601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0022876.000000.32564
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0003110.470000.04486
Phenolic resinProprietary0.0004113.530000.05797
subTotal0.00300100.000000.42847
DieDoped siliconSilicon (Si)7440-21-30.05000100.000007.14112
subTotal0.05000100.000007.14112
Lead FrameCopper alloyChromium (Cr)7440-47-30.000670.240000.09598
Copper (Cu)7440-50-80.2632094.0000037.59087
Tin (Sn)7440-31-50.000670.240000.09598
Zinc (Zn)7440-66-60.000590.210000.08398
Pure metal layerGold (Au)7440-57-50.000220.080000.03199
Nickel (Ni)7440-02-00.013834.940001.97552
Palladium (Pd)7440-05-30.000810.290000.11597
subTotal0.28000100.0000039.99029
Mould CompoundFillerSilica -amorphous-7631-86-90.0782023.0000011.16872
Silica fused60676-86-00.2040060.0000029.13578
Flame retardantMetal hydroxideProprietary0.010203.000001.45679
ImpurityBismuth (Bi)7440-69-90.001700.500000.24280
PigmentCarbon black1333-86-40.001700.500000.24280
PolymerEpoxy resin systemProprietary0.023807.000003.39917
Phenolic resinProprietary0.020406.000002.91358
subTotal0.34000100.0000048.55964
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00013
Non hazardousProprietary0.000010.055500.00159
Tin solderTin (Sn)7440-31-50.0199999.940002.85474
subTotal0.02000100.000002.85646
WireImpurityNon hazardousProprietary0.000000.010000.00010
Pure metalGold (Au)7440-57-50.0071799.990001.02358
subTotal0.00717100.000001.02368
total0.70017100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.