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Chemical content PIMC32PAS-Q

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Type numberPackagePackage descriptionTotal product weight
PIMC32PAS-QSOT1118DHUSON67.05996 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934666064115212601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000781.000000.01105
FillerSilver (Ag)7440-22-40.0655284.000000.92805
PolymerBismaleimidodiphenylmethane resin 0.0078010.000000.11048
Isobornyl Methacrylate7534-94-30.003905.000000.05524
subTotal0.07800100.000001.10482
DieDoped siliconSilicon (Si)7440-21-30.09200100.000001.30312
subTotal0.09200100.000001.30312
DieDoped siliconSilicon (Si)7440-21-30.09200100.000001.30312
subTotal0.09200100.000001.30312
Lead FrameCopper alloyCopper (Cu)7440-50-82.5594195.1100036.25247
Magnesium (Mg)7439-95-40.005380.200000.07623
Nickel (Ni)7440-02-00.085303.170001.20829
Silicon (Si)7440-21-30.018570.690000.26300
Pure metal layerGold (Au)7440-57-50.000540.020000.00762
Nickel (Ni)7440-02-00.019910.740000.28206
Palladium (Pd)7440-05-30.001880.070000.02668
subTotal2.69100100.0000038.11635
Mould CompoundFillerSilica -amorphous-7631-86-90.8942423.0000012.66636
Silica fused60676-86-02.3328060.0000033.04268
Flame retardantMetal hydroxideProprietary0.116643.000001.65213
ImpurityBismuth (Bi)7440-69-90.019440.500000.27536
PigmentCarbon black1333-86-40.019440.500000.27536
PolymerEpoxy resin systemProprietary0.272167.000003.85498
Phenolic resinProprietary0.233286.000003.30427
subTotal3.88800100.0000055.07114
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00129
Tin solderTin (Sn)7440-31-50.1639099.940002.32157
subTotal0.16400100.000002.32296
WireImpurityNon hazardousProprietary0.000010.010000.00008
Pure metalGold (Au)7440-57-50.0549599.990000.77840
subTotal0.05496100.000000.77848
total7.05996100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.