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Chemical content PMDXB600UNE

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMDXB600UNESOT1216DFN1010B-61.23099 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934067655147512601235Kwai Chung, Hong Kong; Sherman, United States Of America; Hsin-chu, Taiwan; Dongguan, China; D-22529 HAMBURG, Germany; Hsinchu, Taiwan 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000221.000000.01787
FillerSilver (Ag)7440-22-40.0184884.000001.50123
PolymerBismaleimidodiphenylmethane resin 0.0022010.000000.17872
Isobornyl Methacrylate7534-94-30.001105.000000.08936
subTotal0.02200100.000001.78718
DieDoped siliconSilicon (Si)7440-21-30.06000100.000004.87413
subTotal0.06000100.000004.87413
Lead FrameCopper alloyCopper (Cu)7440-50-80.4476991.1800036.36860
Magnesium (Mg)7439-95-40.000830.170000.06781
Nickel (Ni)7440-02-00.013942.840001.13278
Silicon (Si)7440-21-30.003040.620000.24730
Pure metal layerGold (Au)7440-57-50.000340.070000.02792
Nickel (Ni)7440-02-00.023034.690001.87068
Palladium (Pd)7440-05-30.002110.430000.17151
subTotal0.49100100.0000039.88660
Mould CompoundFillerSilica -amorphous-7631-86-90.1393823.0000011.32259
Silica fused60676-86-00.3636060.0000029.53720
Flame retardantMetal hydroxideProprietary0.018183.000001.47686
ImpurityBismuth (Bi)7440-69-90.003030.500000.24614
PigmentCarbon black1333-86-40.003030.500000.24614
PolymerEpoxy resin systemProprietary0.042427.000003.44601
Phenolic resinProprietary0.036366.000002.95372
subTotal0.60600100.0000049.22866
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00009
Non hazardousProprietary0.000010.055500.00108
Tin solderTin (Sn)7440-31-50.0239999.940001.94848
subTotal0.02400100.000001.94965
WireImpurityNon hazardousProprietary0.000000.010000.00011
Pure metalGold (Au)7440-57-50.0140099.990001.13764
subTotal0.01401100.000001.13775
WireImpurityNon hazardousProprietary0.000000.010000.00011
Pure metalGold (Au)7440-57-50.0139899.990001.13577
subTotal0.01398100.000001.13588
total1.23099100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.