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Chemical content PMEG045T100EPD

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Type numberPackagePackage descriptionTotal product weight
PMEG045T100EPDSOT1289CFP1573.12000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934068776139212601235D-22529 HAMBURG, Germany; Seremban, MalaysiaLeaded
934068776146212601235Seremban, Malaysia; D-22529 HAMBURG, GermanyLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.51000100.000002.06510
subTotal1.51000100.000002.06510
ClipCopper alloyCopper (Cu)7440-50-87.3460299.8100010.04652
Iron (Fe)7439-89-60.011040.150000.01510
Phosphorus (P)7723-14-00.002940.040000.00403
subTotal7.36000100.0000010.06565
Lead FrameCopper alloyCopper (Cu)7440-50-833.8529998.2100046.29785
Iron (Fe)7439-89-60.003450.010000.00471
Phosphorus (P)7723-14-00.013790.040000.01886
Pure metal layerCopper (Cu)7440-50-80.027580.080000.03771
Silver (Ag)7440-22-40.572201.660000.78255
subTotal34.47000100.0000047.14168
Mould CompoundFillerSilica fused60676-86-014.6686071.0000020.06100
PigmentCarbon black1333-86-40.061980.300000.08476
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-24.0700219.700005.56622
Phenolic resinProprietary1.859409.000002.54294
subTotal20.66000100.0000028.25492
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00000
Bismuth (Bi)7440-69-90.000000.001000.00000
Copper (Cu)7440-50-80.000000.001000.00000
Lead (Pb)7439-92-10.000000.005000.00001
Tin solderTin (Sn)7440-31-50.0899999.990000.12307
subTotal0.09000100.000000.12308
Solder PasteLead alloyLead (Pb)7439-92-18.6236595.5000011.79383
Silver alloySilver (Ag)7440-22-40.225752.500000.30874
Tin alloyTin (Sn)7440-31-50.180602.000000.24699
subTotal9.03000100.0000012.34956
total73.12000100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.