×

Chemical content PMGD175XNE

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMGD175XNESOT363SC-885.52935 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934068835115312601235D-22529 HAMBURG, Germany; Dongguan, China; Hsin-chu, Taiwan; Seremban, Malaysia; Kwai Chung, Hong Kong 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.16000100.000002.89365
subTotal0.16000100.000002.89365
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.001860.090000.03369
Carbon (C)7440-44-00.000830.040000.01497
Chromium (Cr)7440-47-30.004350.210000.07862
Cobalt (Co)7440-48-40.008900.430000.16098
Iron (Fe)7439-89-60.9811847.4000017.74494
Manganese (Mn)7439-96-50.017600.850000.31821
Nickel (Ni)7440-02-00.7392035.7100013.36861
Phosphorus (P)7723-14-00.000410.020000.00749
Silicon (Si)7440-21-30.005380.260000.09734
Sulphur (S)7704-34-90.000410.020000.00749
Pure metal layerCopper (Cu)7440-50-80.2713813.110004.90794
Silver (Ag)7440-22-40.038501.860000.69632
subTotal2.07000100.0000037.43660
Mould CompoundAdditiveNon hazardousProprietary0.084682.900001.53146
Triphenylphosphine603-35-00.001460.050000.02640
FillerSilica -amorphous-7631-86-92.1024072.0000038.02255
PigmentCarbon black1333-86-40.001460.050000.02640
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.4380015.000007.92137
Phenol Formaldehyde resin (generic)9003-35-40.2920010.000005.28091
subTotal2.92000100.0000052.80909
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00020
Bismuth (Bi)7440-69-90.000000.001000.00007
Copper (Cu)7440-50-80.000000.001000.00007
Lead (Pb)7439-92-10.000020.005000.00033
Tin solderTin (Sn)7440-31-50.3699699.990006.69089
subTotal0.37000100.000006.69156
WirePure metalCopper (Cu)7440-50-80.00935100.000000.16909
subTotal0.00935100.000000.16909
total5.52935100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.