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Chemical content PMP5501QAS

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Type numberPackagePackage descriptionTotal product weight
PMP5501QASSOT1216DFN1010B-61.21453 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934660011147312601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000221.000000.01811
FillerSilver (Ag)7440-22-40.0184884.000001.52158
PolymerBismaleimidodiphenylmethane resin 0.0022010.000000.18114
Isobornyl Methacrylate7534-94-30.001105.000000.09057
subTotal0.02200100.000001.81140
DieDoped siliconSilicon (Si)7440-21-30.06000100.000004.94018
subTotal0.06000100.000004.94018
Lead FrameCopper alloyCopper (Cu)7440-50-80.4476991.1800036.86149
Magnesium (Mg)7439-95-40.000830.170000.06873
Nickel (Ni)7440-02-00.013942.840001.14813
Silicon (Si)7440-21-30.003040.620000.25065
Pure metal layerGold (Au)7440-57-50.000340.070000.02830
Nickel (Ni)7440-02-00.023034.690001.89603
Palladium (Pd)7440-05-30.002110.430000.17384
subTotal0.49100100.0000040.42717
Mould CompoundFillerSilica -amorphous-7631-86-90.1393823.0000011.47604
Silica fused60676-86-00.3636060.0000029.93751
Flame retardantMetal hydroxideProprietary0.018183.000001.49688
ImpurityBismuth (Bi)7440-69-90.003030.500000.24948
PigmentCarbon black1333-86-40.003030.500000.24948
PolymerEpoxy resin systemProprietary0.042427.000003.49271
Phenolic resinProprietary0.036366.000002.99375
subTotal0.60600100.0000049.89585
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00009
Non hazardousProprietary0.000010.055500.00110
Tin solderTin (Sn)7440-31-50.0239999.940001.97489
subTotal0.02400100.000001.97608
WireImpurityNon hazardousProprietary0.000000.010000.00009
Pure metalGold (Au)7440-57-50.0115399.990000.94916
subTotal0.01153100.000000.94925
total1.21453100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.