Chemical content PTVS20VU1UPA

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Type numberPackagePackage descriptionTotal product weight
PTVS20VU1UPASOT1061HUSON38.07751 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934071205147512601235Dongguan, China; Seremban, Malaysia; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001101.000000.01362
FillerSilver (Ag)7440-22-40.0924084.000001.14392
PolymerBismaleimidodiphenylmethane resin 0.0110010.000000.13618
Isobornyl Methacrylate7534-94-30.005505.000000.06809
DieDoped siliconSilicon (Si)7440-21-30.69000100.000008.54224
Lead FrameCopper alloyCopper (Cu)7440-50-82.6413794.2000032.70028
Magnesium (Mg)7439-95-40.008410.300000.10414
Nickel (Ni)7440-02-00.098143.500001.21498
Silicon (Si)7440-21-30.024390.870000.30201
Pure metal layerGold (Au)7440-57-50.001120.040000.01389
Nickel (Ni)7440-02-00.028041.000000.34714
Palladium (Pd)7440-05-30.002520.090000.03124
Mould CompoundAdditiveNon hazardousProprietary0.017470.410000.21623
FillerSilica -amorphous-7631-86-90.012350.290000.15294
Silica fused60676-86-03.6699986.1500045.43467
HardenerPhenolic resinProprietary0.182754.290002.26250
PigmentCarbon black1333-86-40.008090.190000.10020
PolymerEpoxy resin systemProprietary0.369348.670004.57247
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00009
Non hazardousProprietary0.000090.055500.00117
Tin solderTin (Sn)7440-31-50.1699099.940002.10335
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalCopper (Cu)7440-50-80.0435099.990000.53855
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.