NEVB-LOGIC03 footprint adapter board
NEVB-LOGIC03 is a dual in-line logic footprint adapter board, designed to simplify the evaluation of Nexperia logic devices by offering several package footprints.
NEVB-LOGIC03 footprint adapter board
Key features & benefits
Plug and play: identify the package you will be using, place the device in the footprint and solder the device down to start evaluating
Packages on the board (4)
| Package | Package name | Package information | Package description | Reference | Date |
|---|---|---|---|---|---|
WLCSP8 (SOT8023-1) |
WLCSP8 | SOT8023-1 | wafer level chip-scale package, 8 bumps; 0.75 x 1.55 x 0.60 mm | 2020-08-12 | |
WLCSP16 (SOT8025-1) |
WLCSP16 | SOT8025-1 | wafer level chip-scale package; 16 bumps; 1.455 mm x 1.455 mm x 0.43 mm bod | 2021-06-16 | |
WLCSP9 (SOT8027-1) |
WLCSP9 | SOT8027-1 | wafer level chip-scale package; 9 bumps; 1.06 mm x 1.06 mm x 0.43 mm body | 2021-06-16 | |
WLCSP9 (SOT8057-1) |
WLCSP9 | SOT8057-1 | wafer level chip-scale pakage; 9 bumps; 0.92 × 0.92 × 0.42 mm body | 2023-06-01 |
Related boards (3)
| Board | Description | Type | Quick links | Shop link | |
|---|---|---|---|---|---|
|
nevb-logic01-footprint-adapter-board | NEVB-LOGIC01 footprint adapter board | Evaluation board | ||
|
nevb-logic02-footprint-adapter-board | NEVB-LOGIC02 footprint adapter board | Evaluation board | ||
|
nevb-logic04-footprint-adapter-board | Logic footprint adapter board (NEVB-LOGIC04) | Evaluation board |
Packages on the board (4)
| Package | Package name | Package information | Package description | Reference | Date |
|---|---|---|---|---|---|
|
WLCSP8 (SOT8023-1) |
WLCSP8 | SOT8023-1 | wafer level chip-scale package, 8 bumps; 0.75 x 1.55 x 0.60 mm | 2020-08-12 | |
|
WLCSP16 (SOT8025-1) |
WLCSP16 | SOT8025-1 | wafer level chip-scale package; 16 bumps; 1.455 mm x 1.455 mm x 0.43 mm bod | 2021-06-16 | |
|
WLCSP9 (SOT8027-1) |
WLCSP9 | SOT8027-1 | wafer level chip-scale package; 9 bumps; 1.06 mm x 1.06 mm x 0.43 mm body | 2021-06-16 | |
|
WLCSP9 (SOT8057-1) |
WLCSP9 | SOT8057-1 | wafer level chip-scale pakage; 9 bumps; 0.92 × 0.92 × 0.42 mm body | 2023-06-01 |
Related boards (3)
| Board | Description | Type | Quick links | Shop link | |
|---|---|---|---|---|---|
|
|
nevb-logic01-footprint-adapter-board | NEVB-LOGIC01 footprint adapter board | Evaluation board | ||
|
|
nevb-logic02-footprint-adapter-board | NEVB-LOGIC02 footprint adapter board | Evaluation board | ||
|
|
nevb-logic04-footprint-adapter-board | Logic footprint adapter board (NEVB-LOGIC04) | Evaluation board |
Documentation (1)
| File name | Title | Type | Date |
|---|---|---|---|
| nexperia_factsheet_dual_in_line_logic_footprint_adapter_boards | Dual in-line Logic footprint adapter boards | Leaflet | 2024-01-24 |
Support
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