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SOT8054-1

SOT8054-1

wafer level chip-scale package; 15 bumps; 1.16 × 1.96 × 0.62 mm body

Package information

Package information Package name Package description Reference Date
SOT8054-1 WLCSP15 wafer level chip-scale package; 15 bumps; 1.16 × 1.96 × 0.62 mm body 2023-06-15

Related documents

File name Title Type Date
SOT8054-1 wafer level chip-scale package; 15 bumps; 1.16 × 1.96 × 0.62 mm body Package information 2023-06-15
SOT8054-1_336 WLCSP15; Reel dry pack for SMD, 7"; Q1/T1 product orientation Packing information 2023-05-29

Products in this package

Analog & Logic ICs

Type number Description Quick access
NEX10001UB 220 mA dual output LCD bias power supply
NEX10000UB 80 mA dual output LCD bias power supply