Package information
| Package information | Package name | Package description | Reference | Date |
|---|---|---|---|---|
| SOT8054-1 | WLCSP15 | wafer level chip-scale package; 15 bumps; 1.16 × 1.96 × 0.62 mm body | 2023-06-15 |
Related documents
| File name | Title | Type | Date |
|---|---|---|---|
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT8054-1 | wafer level chip-scale package; 15 bumps; 1.16 × 1.96 × 0.62 mm body | Package information | 2023-06-15 |
| SOT8054-1_336 | WLCSP15; Reel dry pack for SMD, 7"; Q1/T1 product orientation | Packing information | 2023-05-29 |
Products in this package
Analog & Logic ICs
| Type number | Description | Quick access |
|---|---|---|
| NEX10000UB | 80 mA dual output LCD bias power supply | |
| NEX10001UB | 260 mA dual output LCD bias power supply | |
| NEX10000AUB | 180 mA dual output LCD bias power supply |