Package information
| Package information | Package name | Package description | Reference | Date |
|---|---|---|---|---|
| SOT8067-1 | HWSON8 | plastic thermal enhanced very very thin Small Outline packages, no leads; 8 terminals; 0.5 mm pitch; 2.0 mm x 2.0 mm x 0.75 mm body | MO-229 (JEDEC) | 2023-08-21 |
Related documents
| File name | Title | Type | Date |
|---|---|---|---|
| AN90063 | Questions about package outline drawings | Application note | 2025-06-13 |
| SOT8067-1 | plastic thermal enhanced very very thin Small Outline packages, no leads; 8 terminals;0.5 mm pitch; 2.0 mm x 2.0 mm x 0.75 mm body | Package information | 2025-06-10 |
| SOT8067-1_147 | HWSON8; Reel pack for SMD, 7"; Q2/T3 product orientation | Packing information | 2024-02-01 |
Products in this package
Analog & Logic ICs
| Type number | Description | Quick access |
|---|