SOT1233

X2SON8 (SOT1233)

plastic, leadless thermal enhanced extremely thin small outline package; 8 terminals; 0.5 mm pitch; 1.35 mm x 0.8 mm x 0.35 mm body

Outline drawing

Package version Package name Package description Reference Issue date
SOT1233 X2SON8 plastic, leadless thermal enhanced extremely thin small outline package; 8 terminals; 0.5 mm pitch; 1.35 mm x 0.8 mm x 0.35 mm body 2016-04-21

Related documents

File name Title Type Date
REFLOW_BG-BD-1 Reflow soldering profile Other type 2017-12-01
Nexperia_package_poster Nexperia package poster Leaflet 2019-03-01
Nexperia_document_leaflet_Logic_X2SON_packages_062018 X2SON ultra-small 4, 5, 6 & 8-pin leadless packages Leaflet 2018-06-05
Nexperia_document_guide_MiniLogic_MicroPak_201808 MicroPak leadless logic portfolio guide Brochure 2018-09-03

Products in this package

Analog & Logic ICs
Type number Description Quick access
74AUP1G74GX Low-power D-type flip-flop with set and reset; positive-edge trigger
74AUP2G00GX Low-power dual 2-input NAND gate
74AUP2G08GX Low-power dual 2-input AND gate
74AUP2G125GX Low-power dual buffer/line driver; 3-state
74AUP2G126GX Low-power dual buffer/line driver; 3-state
74AUP2G132GX Low-power dual 2-input NAND Schmitt trigger
74AUP2G32GX Low-power dual 2-input OR gate
74AUP3G34GX Low-power triple buffer
74AXP1T57GX Dual supply configurable multiple function gate
74LVC2G00GX Dual 2-input NAND gate
74LVC2G08GX Dual 2-input AND gate
74LVC2G32GX Dual 2-input OR gate
74LVC2G38GX Dual 2-input NAND gate; open drain
74LVC2G86GX Dual 2-input EXCLUSIVE-OR gate